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Multiscene Ultra Soft Thermal Pad Heatproof Anti Insulation For Computer

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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Multiscene Ultra Soft Thermal Pad Heatproof Anti Insulation For Computer

Multiscene Ultra Soft Thermal Pad Heatproof Anti Insulation For Computer
Multiscene Ultra Soft Thermal Pad Heatproof Anti Insulation For Computer Multiscene Ultra Soft Thermal Pad Heatproof Anti Insulation For Computer

Large Image :  Multiscene Ultra Soft Thermal Pad Heatproof Anti Insulation For Computer

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Multiscene Ultra Soft Thermal Pad Heatproof Anti Insulation For Computer

Description
Volume Resistivity: 1.0*10^13(Ω.cm) Product Name: Blue Ultra Soft Series 1.0w/M.K Thermal Silicone Pad For Computer
Thermal Conductivity: 1.0W/m.K Composition: Silicone
Color: Blue Thickness: 0.5~12.0 (mm)
High Light:

Multiscene Ultra Soft Thermal Pad

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Heatproof Ultra Soft Thermal Pad

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Anti Insulation Computer Thermal Pad

Blue Ultra Soft Series 1.0w/M.K Thermal Silicone Pad For Computer

 

A good solution for the thermal conductive interface material between the mainboard IC on the computer host and the heat sink or shell is the application: ultra soft thermal pad. Compared with traditional thermal conductive interface materials, such as ultra soft thermal pad and thermal conductive phase change material, high-quality ultra soft thermal pad has more advantages in thermal conductivity on motherboard IC.


When the ultra soft thermal pad is used between IC and heat sink, it can better compress and enlarge the contact area, so as to achieve good thermal conductivity. Therefore, the ultra soft thermal pad has been widely used in the host IC. The ultra soft thermal pad can be cut according to the size and shape of the motherboard IC, and has good insulation. It is also very convenient to operate. Both sides are slightly sticky. Just tear off the upper protective film and paste it on a smooth and clean surface.


Thermal conductive ultra soft thermal pad product characteristics: good thermal conductivity; With self-adhesive without additional surface adhesive; High compressibility, soft and elastic, suitable for low pressure applications; Various thickness options are available.

 

 

Product features: Thermal Conductivity: 1.0W/mK, Ultra Soft, Reinforced Gap Filler Pad
Typical applications: Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

 

Product feature:
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ pink pad
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

Multiscene Ultra Soft Thermal Pad Heatproof Anti Insulation For Computer 0

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

Multiscene Ultra Soft Thermal Pad Heatproof Anti Insulation For Computer 1

 

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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