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3w/MK Thermal Conductivity Liquid Gap Filler Multiscene Room Temperature Cure

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

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The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

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3w/MK Thermal Conductivity Liquid Gap Filler Multiscene Room Temperature Cure

3w/MK Thermal Conductivity Liquid Gap Filler Multiscene Room Temperature Cure
3w/MK Thermal Conductivity Liquid Gap Filler Multiscene Room Temperature Cure 3w/MK Thermal Conductivity Liquid Gap Filler Multiscene Room Temperature Cure

Large Image :  3w/MK Thermal Conductivity Liquid Gap Filler Multiscene Room Temperature Cure

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TF300
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

3w/MK Thermal Conductivity Liquid Gap Filler Multiscene Room Temperature Cure

Description
Product Name: 3w/M.K Thermal Conductivity Silicone Liquid Gap Filler Usage Temperature -40~150℃ Composition: Ceramic Filler + Silicone
Thermal Conductivity: 3.0(W/m.K) Color: Light Blue
Breakdown Voltage: ≥7.0(kv/mm) Usage Temperature: -40~150(℃)
High Light:

3w/MK Thermal Liquid Gap Filler

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Multiscene Liquid Gap Filler

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Thermal Conductivity Gap Filler multiscene

3w/M.K Thermal Conductivity Silicone Liquid Gap Filler Usage Temperature -40~150℃


Thermal conductive Liquid Gap Filler is a kind of high-performance mud like thermal conductive material. It is made of silica gel as the matrix and filled with a variety of high-performance ceramic powders. The thermal conductive mud has the characteristics of high thermal conductivity, low thermal resistance, good adhesion on heat dissipation parts, long-term non drying, insulation, automatic filling of gaps, limited increase of limited contact area, infinite compression, etc. It is mainly used in UAV, automobile industry, communication industry, power supply, consumer electronics, etc.


So what value can thermal conductive Liquid Gap Filler bring? The following points can be answered for you: the ultra-low thermal resistance of the thermal clay can optimize the heat dissipation performance of the product. R & D and design convenience. Because the heat conducting Liquid Gap Filler is mud like and permanent adhesive, the product design does not need to consider the limitations of product size and tolerance, but can be flexibly designed according to the design optimization effect. The convenience of purchase management. The Liquid Gap Filler is packed in a needle cylinder. One model and specification of heat transfer mud can meet the needs of multiple models and products, greatly simplifying the purchase management and storage management. The thermal conductive Liquid Gap Filler can realize the process automation. The needle cylinder packaging can use the dispensing machine to realize the automatic dispensing process, which greatly improves the construction efficiency, reduces the labor cost and time cost, and optimizes the stability of the product.

 

Product features:Two-part dispensable gap filler, Thermal conductivity: 1.2-3.5 W/m.k
Typical applications:Networking and Telecommunications

 

Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays

 

Two-part dispensable gap filler

TF Series Thermal Conductive Gap Filler products are two-component pre-formed thermally conductive silicone products, which mainly meet the requirements of low stress and high compressive modulus when the product is in use, and can realize automatic production; it has good contact with electronic products when assembling. A low contact thermal resistance and good electrical insulation characteristics. The cured thermally gap filler is equivalent to a thermally conductive pad, with good high temperature resistance and aging resistance, and can work for a long time at -40~200℃.

 

Purchase information
Packing specification: 50mL(25mL each part) / 400ml(200mL each part)/20kg (10kg each part)

 

Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour

 

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.

 

3w/MK Thermal Conductivity Liquid Gap Filler Multiscene Room Temperature Cure 0

 

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Light Bule Visual
Density(g/cc) 3 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470
Viscosity/Component A (cps) 400000 ASTM D2196
Viscosity/Component B (cps) 400000 ASTM D2196
Hradness,after cure(shore OO) 40 ASTM D22240

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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