Home ProductsThermally Conductive Encapsulant

Anti Corrosion Potting Compound , Heat Resistant Electronic Potting Epoxy

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

I'm Online Chat Now

Anti Corrosion Potting Compound , Heat Resistant Electronic Potting Epoxy

Anti Corrosion Potting Compound , Heat Resistant Electronic Potting Epoxy
Anti Corrosion Potting Compound , Heat Resistant Electronic Potting Epoxy Anti Corrosion Potting Compound , Heat Resistant Electronic Potting Epoxy

Large Image :  Anti Corrosion Potting Compound , Heat Resistant Electronic Potting Epoxy

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: GF
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

Anti Corrosion Potting Compound , Heat Resistant Electronic Potting Epoxy

Description
Product Name: 1.0w/M.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Usage Temperature: -40~150(℃)
Thermal Resistance: 0.15 (℃-in2/W)0.1mm@50psi Dielectric Constant: 5.5(@10mhz)
Flammability: V-0 Thermal Conductivity: 1.0(W/m.K)
High Light:

V-0 thermally conductive epoxy potting compound

,

thermally conductive epoxy potting compound

,

Heat Resistant Electronic Potting Epoxy

1.0w/M.K Thermally Conductive Encapsulant With Silicone For Power Dissipation

 

With the rapid development of science and technology, the power supply tends to be dense and miniaturized, so higher requirements are put forward for the stability of the power supply. In order to avoid the damage of moisture, dust and harmful gas to electronic components, slow down vibration, avoid external force damage and stabilize component parameters to reduce the adverse effects of the outside world to very small, so it is necessary to conduct heat conduction and heat dissipation potting for power supply and other components.


Thermally conductive encapsulant is suitable for thermal potting of common electronic components, power modules and circuit boards. There are also various electronic appliances, such as switching power supply, driving power supply, home appliance controller, network transformer, sensor and so on. The compound of two-component heat-conducting potting adhesive can be stored for a long time after mixing under normal temperature, but it can liquefy rapidly under heating conditions, which is especially conducive to the application on the automatic manufacturing line. No corrosion to metal, good temperature resistance and high temperature aging resistance.


Good thermal conductivity; Good insulation performance, smooth surface and low shrinkage; Low viscosity, easy gas emission; Good solvent resistance and waterproof performance; Long working hours; Excellent thermal shock resistance.

 

Product feature
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time

 

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

 

 

Purchasing Information

Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)

 

Directions for use

• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes

 

Storage

Store in a cool, dry, well-ventilated place.

 

Shelf life

Shelf life of the product is 12 months after date of shipment.

 

Anti Corrosion Potting Compound , Heat Resistant Electronic Potting Epoxy 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Sliver Grey Visual
Density(g/cc) 1.8 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥10.0 ASTM D149
Dielectric Constant(@10mhz) 5.5 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^15 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 0.8 ASTM D5470
Viscosity/Component A (cps) 4500 ASTM D2196
Viscosity/Component B (cps) 4500 ASTM D2196
Hradness,after cure(shore OO) 60 ASTM D22240
Working Time@25℃(min) 30 ISO 9048

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

Send your inquiry directly to us (0 / 3000)