|Product Name:||1.0w/M.K Thermally Conductive Encapsulant With Silicone For Power Dissipation||Usage Temperature:||-40~150（℃）|
|Thermal Resistance:||0.15 (℃-in2/W)0.1mm@50psi||Dielectric Constant:||5.5（@10mhz）|
V-0 thermally conductive epoxy potting compound,
thermally conductive epoxy potting compound,
Heat Resistant Electronic Potting Epoxy
1.0w/M.K Thermally Conductive Encapsulant With Silicone For Power Dissipation
With the rapid development of science and technology, the power supply tends to be dense and miniaturized, so higher requirements are put forward for the stability of the power supply. In order to avoid the damage of moisture, dust and harmful gas to electronic components, slow down vibration, avoid external force damage and stabilize component parameters to reduce the adverse effects of the outside world to very small, so it is necessary to conduct heat conduction and heat dissipation potting for power supply and other components.
Thermally conductive encapsulant is suitable for thermal potting of common electronic components, power modules and circuit boards. There are also various electronic appliances, such as switching power supply, driving power supply, home appliance controller, network transformer, sensor and so on. The compound of two-component heat-conducting potting adhesive can be stored for a long time after mixing under normal temperature, but it can liquefy rapidly under heating conditions, which is especially conducive to the application on the automatic manufacturing line. No corrosion to metal, good temperature resistance and high temperature aging resistance.
Good thermal conductivity; Good insulation performance, smooth surface and low shrinkage; Low viscosity, easy gas emission; Good solvent resistance and waterproof performance; Long working hours; Excellent thermal shock resistance.
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications
Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Directions for use
• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Color/Component B||Sliver Grey||Visual|
|Breakdown Voltage(kv/mm)||≥10.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.5||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^15||ASTM D257|
|Thermal conductivity(W/m.K)||0.8||ASTM D5470|
|Viscosity/Component A (cps)||4500||ASTM D2196|
|Viscosity/Component B (cps)||4500||ASTM D2196|
|Hradness,after cure(shore OO)||60||ASTM D22240|
|Working Time@25℃(min)||30||ISO 9048|
Contact Person: Jason Zhan