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Anticorrosive Thermal Gap Filler

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Anticorrosive Thermal Gap Filler

Anticorrosive Thermal Gap Filler
Anticorrosive Thermal Gap Filler Anticorrosive Thermal Gap Filler

Large Image :  Anticorrosive Thermal Gap Filler

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TM300
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

Anticorrosive Thermal Gap Filler

Description
Product Name: 3W Thermal Conductivity Silicone Gap Filler Usage Temperature -40~150℃ Composition: Silicone
Usage Temperature: -40~150(℃) Thermal Conductivity: 3.0(W/m.K)
Thermal Resistance: 0.3 (℃-in2/W)0.1mm@50psi Volume Resistivity(Ω.cm): 1.0*10^14
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3W Thermal Conductivity Silicone Gap Filler Usage Temperature -40~150℃


Artificial intelligence, autonomous driving, enterprises and other application scenarios are constantly driving the demand for memory, data storage and processing capacity. Solid state drives (SSDs) are favored by many friends because of their high read-write speed and small size. They can manage a large number of workloads without reducing performance.

 

The function of SSD is to quickly read and store data. After a long time of operation, multiple nands in SSD will be seriously heated, and the volume of SSD is small. It is mainly through conduction heat dissipation. The heat generated on the NAND can only be quickly transferred to the shell through the thermal conductive interface material, and then quickly dissipated through the shell. This is why many solid state disk enclosures are made of metal.

 

Before, the gap between the heating device and the radiator was mainly filled with thermal conductive silicone grease. The heat conductive silicone grease will leak oil and dry out after long-term application, which will affect the service life of solid-state disk. The thermal conductive gap filler has a lower oil yield and will not dry after long-term use. It can be produced automatically. It can ensure that the dosage is controllable during dispensing. It is to help meet the dispensing requirements of solid-state drives, so as to improve production efficiency. It also has high thermal conductivity, lower thermal resistance and better interface humidity, which helps SSD products achieve better stability and reliability.

 

Thermal conductive gap filler product characteristics:

1. Good thermal conductivity: 1.5w/mk-7.0w/mk;
2. Soft, almost no pressure with the device;
3. Low thermal impedance;
4. It can be easily used for automatic operation of dispensing system;
5. Long term reliability;
6. Comply with UL94V0 fire rating.

 

 

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

 

Purchasing information
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail

 

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

 

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

 

Anticorrosive Thermal Gap Filler 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color Green Visual
Density(g/cc) 2.9 ASTM D792
Extrudability(g/s) 5.0 ISO9048
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥5.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^14 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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