|Product Name:||3W Thermal Conductivity Silicone Gap Filler Usage Temperature -40~150℃||Composition:||Silicone|
|Usage Temperature:||-40~150（℃）||Thermal Conductivity:||3.0（W/m.K）|
|Thermal Resistance:||0.3 (℃-in2/W)0.1mm@50psi||Volume Resistivity(Ω.cm):||1.0*10^14|
Anticorrosive Thermal Gap Filler,
Heatproof Thermal Gap Filler,
Anti Seismic Liquid Gap Filler
3W Thermal Conductivity Silicone Gap Filler Usage Temperature -40~150℃
Artificial intelligence, autonomous driving, enterprises and other application scenarios are constantly driving the demand for memory, data storage and processing capacity. Solid state drives (SSDs) are favored by many friends because of their high read-write speed and small size. They can manage a large number of workloads without reducing performance.
The function of SSD is to quickly read and store data. After a long time of operation, multiple nands in SSD will be seriously heated, and the volume of SSD is small. It is mainly through conduction heat dissipation. The heat generated on the NAND can only be quickly transferred to the shell through the thermal conductive interface material, and then quickly dissipated through the shell. This is why many solid state disk enclosures are made of metal.
Before, the gap between the heating device and the radiator was mainly filled with thermal conductive silicone grease. The heat conductive silicone grease will leak oil and dry out after long-term application, which will affect the service life of solid-state disk. The thermal conductive gap filler has a lower oil yield and will not dry after long-term use. It can be produced automatically. It can ensure that the dosage is controllable during dispensing. It is to help meet the dispensing requirements of solid-state drives, so as to improve production efficiency. It also has high thermal conductivity, lower thermal resistance and better interface humidity, which helps SSD products achieve better stability and reliability.
Thermal conductive gap filler product characteristics:
1. Good thermal conductivity: 1.5w/mk-7.0w/mk;
2. Soft, almost no pressure with the device;
3. Low thermal impedance;
4. It can be easily used for automatic operation of dispensing system;
5. Long term reliability;
6. Comply with UL94V0 fire rating.
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan