|Product Name:||0.5mm Thickness Pink Low Volume Resistivity Silicone Thermal Pad Material||Composition:||Silicone|
|Usage Temperature(℃):||-40~150||Thermal Conductivity:||8.0±0.5（W/m.K）|
Thermal Gap Filler Pads Ultrasoft,
Ultrasoft Thermal Gap Filler Pads,
0.5mm Heat Sink Rubber Pads
0.5mm Thickness Pink Low Volume Resistivity Silicone Thermal Pad Material
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
The thermal pad material is attached to the heat source for heat dissipation after foaming, which will not only affect the effective contact area of the thermal pad material, but also enter air into the bubble, thus increasing the thermal resistance. The effective contact area and thermal resistance are the two most important performance parameters to judge the thermal conductivity of a thermal conductive pad except the thermal conductivity. Therefore, the thermal conductive silicone film should not be shipped after foaming and must be classified as defective.
Insufficient exhaust. After the silica gel raw material is placed in the forming mold, a lot of air will be brought into the mold at the moment of closing. However, the air cannot be integrated with the silica gel raw material. If these air are not discharged, bubbles will be generated on the surface of the silica gel key after forming.
The vulcanization time is too short. Like the vulcanization temperature, the vulcanization time is also one of the important parameters for the formation of tthermal pad material. The length of vulcanization time determines whether the thermal conductive silicone pad can be completely vulcanized. If the vulcanization time is too short, it will not only cause the thermal conductive silicone pad to soften after forming, but also cause bubbles on the surface of the thermal conductive silicone pad. In case of such defects, the curing time of silica gel can be appropriately prolonged.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||--|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan