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Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft

Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft
Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft
Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft

Large Image :  Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400 mm x 200 mm
Delivery Time: 13-15 working days
Payment Terms: T/T

Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft

Description
Product Name: Ultra Soft 8.0W/m.K Thermal Conductivity Thermal Pad Material With Blue Silicone Composition: Silicone
Density(g/cc): 3.35 Thermal Conductivity: 8.0±0.5(W/m.K)
Color: Blue Volume Resistivity: 1.0*10^12(Ω.cm)
High Light:

Heatproof Thermal Pad Material

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Multipurpose Thermal Pad Material

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Odorless Soft Thermal Pads

Ultra Soft 8.0W/m.K Thermal Conductivity Thermal Pad Material With Blue Silicone

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 1012 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470

 

Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft 0

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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