|Product Name:||Ultra Soft 8.0w Thermal Conductivity Thermal Pad Material With Blue Silicone||Composition:||Silicone|
Heatproof Thermal Pad Material,
Multipurpose Thermal Pad Material,
Odorless Soft Thermal Pads
Ultra Soft 8.0w Thermal Conductivity Thermal Pad Material With Blue Silicone
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
What is the compressibility of thermal pad material?
This is easy to understand. Let's take our thermal pad material sheet for example. Under the same environment, using different pressures, the heat-conducting silica gel sheet deforms under the slowly increasing pressure. Finally, it has a new thickness. The compressibility is to divide the deformed thickness by the original thickness.
What is the thermal resistance of thermal pad material?
The thermal resistance of thermal conductive pad is a comprehensive parameter reflecting the ability to prevent heat transfer. That is, the blocking effect of objects on heat conduction. In the engineering application of heat transfer, in order to meet the requirements of production process, sometimes the heat transfer is strengthened by reducing the thermal resistance; Sometimes, the heat transfer is restrained by increasing the thermal resistance.
The influence of the compressibility of the thermal pad material on the thermal resistance is that the compressibility is inversely proportional to the thermal resistance when other conditions remain unchanged. That is to say, with the increase of compressibility, the thermal resistance is continuously decreasing. This is a general trend for thermal pad. The thinner the thermal conductive pad, the lower the thermal resistance. The greater the compression ratio, the thinner the thickness that can be extended, and the thermal resistance will be reduced to the greatest extent. In the product design stage, if thermal conductive silicon film is required between the product and the radiator, the thinner the gap is designed, the better. In this way, when the thermal conductive pad is installed, the thermal resistance will be very small, and the thermal conductive effect will be better.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan