|Product Name:||8w Thermal Conductivity 55 Shore Oo Hardness Silicone Soft Thermal Pad Material||Composition:||Silicone|
|Hardness:||55 Shore Oo||Thermal Conductivity:||8.0±0.5（W/m.K）|
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8w Thermal Conductivity 55 Shore Oo Hardness Silicone Soft Thermal Pad Material
All thermal conductive silicone pad are insulated, but thermal pad are only thermal conductive and filling gaps after all, and are not recommended to be used in high-voltage environment. The service life of most thermal conductive silica gel gaskets in the market is about 3 years, while all thermal pad of TP series have passed the high-temperature aging test, and the shelf life is twice that of peers, up to 5-8 years.
The rubber component in the raw material of the thermal pad material contains adhesive, so it will have its own viscosity. Is it convenient to reuse the heat conductive silicone pad with its own viscosity? Whether it can be reused needs to be judged according to the viscosity. Generally, the self-adhesive heat conducting silicone pad can be reused, because the self-adhesive is not very strong, and it is easy to be reworked without damaging or deforming the heat conducting silicone pad. However, due to product structure problems, some customers need the thermal pad material to have a strong viscosity to fix it. Therefore, the thermal pad material is provided with one-sided or two-sided adhesive backing. Because the adhesive backing is relatively strong, it is not convenient to reuse it. In particular, when encountering the aluminum surface or electroplated surface, special care should be taken to avoid tearing or delamination, The self-adhesive thermal conductive silicone pad is easier to be reused than the adhesive backed thermal conductive pad.
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan