|Product Name:||Die Cutting Blue 0.5mm Thickness Thermal Silicone Pad Material With 8.0 W/m.K||Composition:||Silicone|
|Thermal Conductivity:||8.0 W/m.K||Color:||Blue|
|Thickness(mm):||0.5-10 Mm||Usage Temperature(℃):||-40 ℃~150 ℃|
0.5mm Thermal Pad Material,
8W/MK Thermal Pad Material,
Blue Thermal Pad Silicone
Die Cutting Blue 0.5 mm Thickness Thermal Silicone Pad Material With 8.0 W/m.K
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
The use of heat dissipation module is one of the unique and limited heat dissipation methods for most compact electronic products, and it is also the most important heat dissipation method at present. In the heat dissipation module, most of them use heat conductive silicone gasket and other similar products to assist heat conduction and dissipation, so as to achieve better heat dissipation effect.
The specific material selection of the Thermal Pad Material in the heat dissipation module shall be comprehensively determined according to the specific conditions.
(1) The thermal conductivity of Thermal Pad Material shall be determined according to the temperature difference and heat dissipation effect.
(2) According to the actual product gap (the gap between the heat source and the radiator), select the appropriate thickness of thermal conductive silicone gasket, etc. Here, I will introduce the thermal conductivity of the thermal conductive pad and the thickness selection of the thermal conductive silicone gasket, hoping to help you better select the type.
For the thickness of Thermal Pad Material, customers often choose the corresponding thickness according to the actual gap size of the product, which is incorrect. For example, if the gap of the product is 1.5mm, most customers will directly choose the thermal conductive pad with a thickness of 1.5mm for thermal conduction and heat dissipation, but the actual application effect is not very good, so they choose the thermal conductive pad with higher thermal conductivity. In fact, if we change the product thickness a little, the heat conduction effect will be significantly improved. The product with a gap of 1.5mm generally uses a 2.0mm heat conduction silicone gasket or a gasket with a thickness greater than 1.5 mm.
■ Thermal conductivity:8.0 W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200 mm * 400 mm; T＞1.5 mm,size=150 mm*150 mm; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan