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Product Details:
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| Product Name: | Blue 2.0 W/m.K Die Cutting 10.0 Mm Thickness Silicon Free Thermal Pad | Color: | Blue |
|---|---|---|---|
| Thickness: | 1.0~10.0 Mm | Density: | 2.9 G/cc |
| Hardness: | 45 Shore OO | Thermal Conductivity: | 2.0 W/m.K |
| High Light: | Multiscene Silicone Free Thermal Pad,2W/M.K Silicone Free Thermal Pad,Ultrasoft High Performance Thermal Pad |
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| Attribute | Value | Test Method |
|---|---|---|
| Composition | Acrylate | - |
| Color | Blue | Visual |
| Thickness(mm) | 0.5-10.0 | ASTM D374 |
| Density(g/cc) | 2.9 | ASTM D792 |
| Hardness(shore oo) | 45±5 | ASTM D2240 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥6.0 | ASTM D149 |
| Flammability | V-1 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 2.0 | ASTM D5470 |
Application of silicon free thermal pad:
Hard disk
Optical precision equipment
Notebook computer, projector and OA office electronic products
Mobile and communication equipment, high-speed mass
Storage drives, heat pipe assemblies, automotive engine control equipment
Telecommunication hardware and equipment, high-end industrial control and medical electronics
Product feature
■ Thermal conductivity: 2.0,3.0 W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.
■ No siloxane volatilization
■ High thermal conductivity
■ High insulation
■ High compressibility
Typical applications
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
■ Hard disk
■ Optical precision equipment
■ Notebook computer, projector and OA office electronic products
■ Mobile and communication equipment, high-speed mass
■ Storage drives, heat pipe assemblies, automotive engine control equipment
■ Telecommunication hardware and equipment, high-end industrial control and medical electronics
Contact Person: Jason Zhan
Tel: +8613923884646
