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Product Details:
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| Product Name: | Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks | Composition: | Silicon + Ceramic Filler |
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| Color: | Pink | Tensile Strength(KN/m): | 2.5 |
| Density: | 2.5(g/cc) | Thermal Conductivity(W/m.K): | 1.0 |
| High Light: | Pink Ultra Soft Thermal Pad,Silicone Ultra Soft Thermal Pad,Weather Resistant Thermal Pad In Laptop |
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| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler, Silicone, and Reinforced Fiberglass | - |
| Color | White and Brick Red | Visual |
| Thickness(mm) | 0.5~12.0 | ASTM D374 |
| Density(g/cc) | 2.5 | ASTM D792 |
| Hardness(shore oo) | 30±5 | ASTM D2240 |
| Tensile Strength(KN/m) | 2.5 | ASTM D624 |
| Elongation(%) | 60 | ASTM D412 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥7.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 5.7 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1013 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 1.0±0.1 | ASTM D5470 |
Product feature:
■ Thermal Conductivity:1.0 W/m.K
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%
Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs
Purchase information:
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
Contact Person: Jason Zhan
Tel: +8613923884646
