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0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

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0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling
0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling 0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

Large Image :  0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP120
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Packaging Details: 400 mm x 200 mm
Delivery Time: 13-15 working days
Payment Terms: T/T

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

Description
Product Name: TP 120 Series 1.2 W/m.K Thermal Conductivity Pad For Electronics Heat Transfer Composition: Ceramic Filler + Silicone
Color: Pink Thickness: 0.5~12.0 Mm
Density: 2.3 G/cc Hardness: 20±5 (Shore OO)
High Light:

0.5mm Thermal Conductive Pad

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Cooling Thermal Conductive Pad

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2.3g/Cc Thermal Cooling Pad

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer

 
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/m.K, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications. thermal conductivity pad is a thermal conductive medium material synthesized by special process with silica gel as the base material and metal oxide and other auxiliary materials. In the industry, it is also known as thermal conductive silica gel pad, thermal silicon film, soft thermal conductive pad, thermal conductive silica gel pad and so on.
 
Generally, before selecting thermal conductive pad, the following should be considered: electronic product structure, thermal conductivity, size, thickness, thermal resistance and expected effect. Under different requirements and use environments, the heat dissipation schemes are different. The optimal heat dissipation scheme should be selected in combination with the actual situation. In the structural design of electronic products, it should be considered to integrate the thermal conductive pad into the design problem, and design a reasonable heat dissipation structure to maximize the role of the thermal conductive silicon film. The selection of thermal conductivity depends on the effect you expect to achieve, the power consumption of the heat source and the heat that can be dissipated by the design of the radiator or heat dissipation structure. According to these requirements, the thermal conductivity of thermal pad is selected. The cost of low thermal conductivity is relatively low. The effect of high thermal conductivity is good and the cost is high. The thickness of the thermal conductive pad shall take into account the heat dissipation scheme used by the electronic product itself. If the heat dissipation structure is selected for heat dissipation, the morphological structure of the heat dissipation structure on the contact surface shall be considered, and the balance shall be made between the designed structure and the thickness of the thermal conductive silicone pad. Thickness selection is also related to product hardness, density, compression ratio and other parameters. The best size of thermal pad is to cover the heat source. The breakdown voltage, resistance and surface resistivity can meet the conditions.
 
 
 
Product feature:

  • Thermal Conductivity:1.2 W/m.K
  • Ultra soft and highly compliant
  • With electrical insulation
  • Low pressure versus deflection
  • It has the effect of shock absorption and sound absorption

Typical applications:

  • With MOS tube and transformer
  • IT: Notebooks, Tablets, Power Conversion
  • Industrial: LEDs, Power Supplies and Conversion
  • Automotive: Control Modules, Turbo Actuators
  • Consumer Electronics: Gaming Systems, and LCDs

Purchase information:
 
0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling 0
 
0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling 1
 
 
 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness (mm) 0.5~12.0 ASTM d374
Density (g/cc) 2.3 ASTM D792
Hardness (Shore OO) 20±5 ASTM D2240
Tensile Strength(kn/m) 0.4 ASTM D624
Elongation % 52 ASTM D412
Usage Temperature(℃) -40~150 -
Electrical    
Breakdown Voltage(kv/mm) ≥6.5 ASTM D149
Dielectric Constant(@1mhz) 5.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^12 ASTM D257
Flammability V-0 UL94
 Thermal    
Thermal conductivity(W/m.K) 1.2±0.1 ASTM D5470

 

Contact Details
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Contact Person: Jason Zhan

Tel: +8613923884646

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