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AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

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China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

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AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity
AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity
AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Large Image :  AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Description
Product Name: Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Composition: Silicone
Elongation %: 52 Thickness: 0.5~12.0(mm)
Thermal Conductivity(W/m.K): 1.2 Hardness: 20±5 (Shore OO)
High Light:

AOK Heat Sink Silicone Pad

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Ultrasoft Heat Sink Silicone Pad

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CPU Gap Pad Thermal Conductivity

Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness (mm) 0.5~12.0 ASTM d374
Density (g/cc) 2.3 ASTM D792
Hardness (Shore OO) 20±5 ASTM D2240
Tensile Strength(kn/m) 0.4 ASTM D624
Elongation % 52 ASTM D412
Usage Temperature(℃) -40~150 -
Electrical    
Breakdown Voltage(kv/mm) ≥6.5 ASTM D149
Dielectric Constant(@1mhz) 5.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1012 ASTM D257
Flammability V-0 UL94
 Thermal    
Thermal conductivity(W/m.K) 1.2±0.1 ASTM D5470

 

Product feature:

  • Thermal Conductivity:1.2W/m.K
  • Ultra soft and highly compliant
  • Naturally tacky, easing application
  • Low pressure versus deflection
  • Excellent, high volume applications

Typical applications:

  • Networking and Telecommunications
  • IT: Notebooks, Tablets, Power Conversion
  • Industrial: LEDs, Power Supplies and Conversion
  • Automotive: Control Modules, Turbo Actuators
  • Consumer Electronics: Gaming Systems, and LCDs

Purchase information:

 

 

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity 0

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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