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AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

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AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity
AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Large Image :  AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Description
Product Name: Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Composition: Silicone
Elongation %: 52 Thickness: 0.5~12.0(mm)
Thermal Conductivity(W/m.K): 1.2 Hardness: 20±5 (Shore OO)
High Light:

AOK Heat Sink Silicone Pad

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Ultrasoft Heat Sink Silicone Pad

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CPU Gap Pad Thermal Conductivity

Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting

 

Thermal conductive pad is high-performance,thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment,and heat sink or product outer coving.With nice stickiness, flexibility, good compression performance and excellent heat conductivity designed for it,it makes the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.

 

The main purpose of the thermal conductive pad is to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the radiator. It only plays the role of heat conduction, forms a good heat conduction path between the heating body and the heat sink, and forms a heat dissipation module together with the heat sink, Structural Fasteners (fans). It can well fill the gap between the contact surfaces and squeeze air out of the contact surfaces. Air is a poor conductor of heat, which will seriously hinder the transfer of heat between the contact surfaces; With the supplement of thermal pad, the contact surface can be in better and full contact, so that the face-to-face contact can be truly realized, and the temperature response can reach the minimum temperature difference.

 

 

Thermal Conductive Silicon Pad is a kind of thermal interface with high performance. It is soft, self-sticky and elastic. It can fill the gap between heat-generating components and heat sink, metal mechanism and shell or other cooling devices. The heat can be transferred out speedily so as to improve the electronic components' working efficiency and prolong the life-span of equipments.

 

 

Product feature:

  • Thermal Conductivity:1.2W/mK
  • Ultra soft and highly compliant
  • Naturally tacky, easing application
  • Low pressure versus deflection
  • Excellent, high volume applications

Typical applications:

  • Networking and Telecommunications
  • IT: Notebooks, Tablets, Power Conversion
  • Industrial: LEDs, Power Supplies and Conversion
  • Automotive: Control Modules, Turbo Actuators
  • Consumer Electronics: Gaming Systems, and LCDs

Purchase information:

 

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity 0

 

 

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity 1

 

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness (mm) 0.5~12.0 ASTM d374
Density (g/cc) 2.3 ASTM D792
Hardness (Shore OO) 20±5 ASTM D2240
Tensile Strength(kn/m) 0.4 ASTM D624
Elongation % 52 ASTM D412
Usage Temperature(℃) -40~150 -
Electrical    
Breakdown Voltage(kv/mm) ≥6.5 ASTM D149
Dielectric Constant(@1mhz) 5.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^12 ASTM D257
Flammability V-0 UL94
 Thermal    
Thermal conductivity(W/m.K) 1.2±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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