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Product Details:
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| Product Name: | 8 W/m.K Thermal Conductivity Pink 10 Mm Thickness Thermal Pad Material For Heatsink | Composition: | Ceramic Filler + Silicone |
|---|---|---|---|
| Color: | Pink | Thickness: | 0.5~10 Mm |
| Dielectric Constant: | 7.2（@10mhz） | Volume Resistivity: | 1.0*10^12（Ω.cm） |
| Thermal Conductivity: | 8.0 W/m.K | ||
| High Light: | Thermal Sheet CPU Silicone,Silicone Thermal Sheet CPU,Odorless Electrical Insulation Sheet Material |
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| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Pink | Visual |
| Thickness(mm) | 0.5~10 | astm d374 |
| Density(g/cc) | 3.35 | ASTM D792 |
| Hardness(shore oo) | 55±10 | ASTM D2240 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ＞6.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.2 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1012 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 8.0±0.5 | ASTM D5470 |
Product feature
■ Thermal conductivity:8.0 W/m.K
■ High thermal conductivity
■ The material is soft, with good compressibility, good thermal conductivity and insulation, and a large adjustable range of thickness. It is suitable for filling the cavity. Both sides have natural viscosity and strong operability and maintainability;
■ High electrical insulation
■ High compression rate
■ Low compression force
Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Contact Person: Jason Zhan
Tel: +8613923884646
