Home ProductsThermal Pad Material

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

I'm Online Chat Now

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material
Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

Large Image :  Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP800
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

Description
Product Name: 8W Thermal Conductivity Pink 10mm Thickness Thermal Pad Material For Heatsink Composition: Ceramic Filler + Silicone
Color: Pink Thickness: 0.5~10(mm)
Dielectric Constant: 7.2(@10mhz) Volume Resistivity: 1.0*10^12(Ω.cm)
Thermal Conductivity: 8.0W/mK
High Light:

Thermal Sheet CPU Silicone

,

Silicone Thermal Sheet CPU

,

Odorless Electrical Insulation Sheet Material

8W Thermal Conductivity Pink 10mm Thickness Thermal Pad Material For Heatsink

 

Thermal Pad Material is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap, complete the heat transfer between the heating part and the cooling part, and also play the role of insulation, shock absorption, sealing, etc., which can meet the design requirements of miniaturization and ultra-thin equipment. It is a kind of excellent thermal conductive filling material with processability and usability and wide application range of thickness.

 

TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink 

 

The thermal pad mterial is used to fill the air gap between the heating device and the heat sink or metal base. Their flexible and elastic characteristics enable it to cover very uneven surfaces. The heat is transmitted from the discrete devices or the whole PCB to the metal shell or diffusion plate, which can improve the efficiency and service life of the heating electronic components. In the use of gaskets, pressure and temperature restrict each other. With the increase of temperature, after the equipment operates for a period of time, the gasket material will soften, creep and stress relaxation, and the mechanical strength will also decrease, and the sealing pressure will decrease.

 


Product feature
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
The material is soft, with good compressibility, good thermal conductivity and insulation, and a large adjustable range of thickness. It is suitable for filling the cavity. Both sides have natural viscosity and strong operability and maintainability;
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

Purchase information:

 

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material 0

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

 

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material 1

 

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 10^12 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

Send your inquiry directly to us (0 / 3000)