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Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

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Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device
Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device
Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Large Image :  Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP800
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400 mm x 200 mm
Delivery Time: 13-15 working days
Payment Terms: T/T

Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Description
Product Name: Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device Composition: Ceramic Filler + Silicone
Color: Pink Volume Resistivity: 1.0*10^12(Ω.cm)
Flammability: V-0 Thermal Conductivity: 8.0±0.5(W/m.K)
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Anti Seismic Thermal Pad Material

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Telecom Thermal Pad Material

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Anticorrosive Thin Thermal Pad

Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 1012 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470


Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device 0

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 1012 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470
 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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