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Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

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China Shenzhen Aochuan Technology Co., Ltd certification
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Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device
Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Large Image :  Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP800
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Description
Product Name: Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device Composition: Ceramic Filler + Silicone
Color: Pink Volume Resistivity: 1.0*10^12(Ω.cm)
Flammability: V-0 Thermal Conductivity: 8.0±0.5(W/m.K)
High Light:

Anti Seismic Thermal Pad Material

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Telecom Thermal Pad Material

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Anticorrosive Thin Thermal Pad

Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device

 

TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink

 

Thermal Pad Material is a kind of material with high thermal conductivity. It is mainly composed of aluminum oxide (the content of aluminum oxide is more than 96%), with pure white appearance and hard texture. It is mainly used for heat transfer and electrical isolation between power devices and radiators.

 

After it is closely combined with power devices (such as power MOS transistor, power triode, etc.), aluminum radiator and PCB board, it has excellent sealing performance, can achieve the ideal effect of dust prevention, waterproof, heat conduction and insulation, can adapt to the harsh working environment of high temperature, high pressure and dust, and improve the safety and stability of equipment operation.

 

The thermal pad mterial is used as the heat conducting material between the power device and the radiator, which has the advantages of high heat conducting efficiency, high temperature / high pressure resistance, uniform heating, fast heat dissipation, simple and compact structure, and has a wide application prospect in high-power power products.

 


Product feature
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

Purchase information:

 

Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device 0

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

 

Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device 1

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 10^12 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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