|Product Name:||High Thermal Conductivity High Electrical Insulation Pink Thermal Pad Material||Thermal Conductivity:||8.0±0.5（W/m.K）|
|Composition:||Ceramic Filler + Silicone||Color:||Pink|
Durable GPU Heat Pads,
Multiscene GPU Heat Pads,
Anti Insulation Silicone CPU Pad
High Thermal Conductivity High Electrical Insulation Pink Thermal Pad Material
The type and thermal conductivity of the selected thermal pad are determined, and the compression stress curve of the thermal pad mterial is obtained; According to the maximum allowable pressure of the chip and the compression stress curve of the thermal pad, the maximum compression ratio of the thermal pad is obtained; According to the maximum compressibility of the thermal pad, the thickness of the thermal pad is selected to obtain the reserved gap value of the thermal pad. The recommended compressibility of the thermal pad is not less than 25%; According to the reserved gap value of the heat conduction pad, the size of the heat dissipation plate shall be designed, and attention shall be paid to avoid cumulative error and warping deformation; According to the thickness tolerance of the chip and the processing level of the workshop, the change range of the chip height after welding is calculated, and the change range of the chip height after welding is divided into sections. The thermal pad mterial with different thickness are selected according to different sections.
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan