|Product Name:||Low Thermal Resistance 8W/MK Pink Silicone Thermal Pad Material For Networking||Composition:||Silicone|
Tasteless Thermal Pad Material,
Tasteless IC Thermal Pad Material,
Networking IC Thermal Pad
Low Thermal Resistance 8W/MK Pink Silicone Thermal Pad Material For Networking
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
In order to meet the reliability application requirements of industrial switches, most of the whole machine adopts the fan less heat dissipation design. For chips with large heat generation, heat conducting silica gel gasket and heat conducting phase change material can be used to fill the gap between the contact surface and form a heat conducting channel from the chip surface to the shell, so as to ensure that the chip works in a safe temperature range and that the switch can work reliably and safely in a high temperature environment.
The Thermal Pad Material is an elastic object, which can effectively ensure that the heat conducting gasket fits closely with the inner surface of the switch shell; Part of the heat generated by the circuit board is transferred to the metal radiator through the upper thermal conductive gasket, and then diffused to the inside of the switch, and then diffused to the air through the switch shell. Part of the heat is transferred to the switch shell through the lower thermal conductive gasket, and then diffused to the air; This scheme is especially suitable for small switches, which can effectively avoid the problems of volume increase, cost increase and easy damage caused by the installation of cooling fans.
The Thermal Pad Material is mainly used for heat conduction and heat dissipation between the main board and the shell. The main purpose of selecting the thermal pad material is to reduce the contact thermal resistance between the heat source surface and the contact surface of the radiator. The thermal pad material can well fill the gap of the contact surface; With the supplement of thermal conductive silicon film, the contact surface between the heat source and the radiator can be in better and full contact, so as to truly achieve face-to-face contact, and the temperature response can achieve the minimum temperature difference; The heat conducting silica gel sheet not only has the insulating property, but also has the effect of shock absorption and sound absorption.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan