|Product Name:||0.5mm Thickness Pink Silicone Thermal Pad Material For Power Modules||Thickness:||0.5~10(mm)|
|Composition:||Ceramic Filler + Silicone||Color:||Pink|
RoHS Thermal Pads PCB,
0.5mm Thermal Pads PCB,
Nontoxic Electrically Conductive Thermal Pad
0.5mm Thickness Pink Silicone Thermal Pad Material For Power Modules
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
Thermal Pad Material is mainly used for the transfer interface between electronic equipment and heat sink or product shell. It has good viscosity, flexibility, compressibility and excellent thermal conductivity, so that it can completely exhaust the air between electronic components and heat sink in use, so as to achieve contact filling and significantly improve the heat dissipation effect. The operation process of the heat conducting gasket is relatively simple, but there are also several points that need to be paid attention to. A little carelessness may damage the heat dissipation function of the silicon film. Today, I will mainly talk about the correct use of heat-conducting gasket.
1, Keep the contact surface between the electronic components and the thermal pad material clean to avoid dirt on the surface of the electronic components. Any dirt on the contact surface will lead to poor self-adhesion and sealing heat conductivity of the heat-conducting gasket.
2, When taking the thermal pad , the one with large area should be picked up from the middle part, because if the large heat-conducting gasket is picked up from the edge part, it is easy to suffer uneven stress, resulting in the deformation of the heat-conducting gasket, affecting the subsequent operation and even damaging the silicon film. The sheet with small area is not required.
3, The left hand holds the thermal pad material, and the right hand tears off one of the protective films. When using, keep in mind that the protective films on both sides cannot be torn off at the same time, and try to reduce the number and area of direct contact with the thermal conductive gasket, so as to keep the self-adhesive and thermal conductivity of the thermal conductive gasket from being damaged.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan