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Odorless PC Thermal Pad Material Oilproof Anti Insulation Durable

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Odorless PC Thermal Pad Material Oilproof Anti Insulation Durable

Odorless PC Thermal Pad Material Oilproof Anti Insulation Durable
Odorless PC Thermal Pad Material Oilproof Anti Insulation Durable Odorless PC Thermal Pad Material Oilproof Anti Insulation Durable

Large Image :  Odorless PC Thermal Pad Material Oilproof Anti Insulation Durable

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Odorless PC Thermal Pad Material Oilproof Anti Insulation Durable

Description
Product Name: 8w Thermal Conductivity Pink Silicone Soft Thermal Pad Material For CPU Composition: Silicone
Color: Pink Thermal Conductivity: 8.0±0.5(W/m.K)
Breakdown Voltage: ≥6.0(kv/mm) Volume Resistivity: 1.0*10^12(Ω.cm)
High Light:

Odorless Thermal Pad Material

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Oilproof Thermal Pad Material

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Anti Insulation Thermal Pad PC

8w Thermal Conductivity Pink Silicone Soft Thermal Pad Material For CPU

 

The thermal pad material is placed between the heating element and the radiating element to fill the gap between them for heat conduction. This is because there are many gaps on the surface of the heating element and the radiator, which need to be filled with thermal pad material.

 

The thermal conductivity of thermal pad has no relationship with thickness. The size, shape and thickness of the material itself will not affect the thermal conductivity. Although the thickness does not affect the thermal conductivity, it affects the thermal resistance. If the thickness of the thermal conductive silicone gasket with the same coefficient is different, the thermal conductivity effect will be different. The thinner the heat conducting silica gel sheet, the better the heat conducting performance. The choice of thickness mainly depends on the specific heat dissipation object. When selecting thermal conductive silica gel sheet for electronic products, the thickness shall be determined according to the actual situation: too thick or too thin will cause corresponding waste. To serve complex circuits, the thickness of silicon film on each chip should be selected in detail. It is impossible to solve all problems with a unified thickness. There is also the choice of shockproof effect. The thermal conductive pad has certain compressibility, which has a good shockproof buffer and fall resistance for chip devices.

 

TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink


Product feature
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

Purchase information:

 

Odorless PC Thermal Pad Material Oilproof Anti Insulation Durable 0

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

 

Odorless PC Thermal Pad Material Oilproof Anti Insulation Durable 1

 

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 10^12 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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