|Product Name:||Pink 8.0W Thermal Conductivity 55 Shore OO Hardness Silicone Thermal Pad Material||Composition:||Silicone|
|Hardness:||55 Shore OO||Dielectric Constant:||7.2（@10mhz）|
Nontoxic Heat Sink Silicone Rubber,
Multiscene Heat Sink Silicone Rubber,
Odorless High Quality Thermal Pads
Pink 8.0W Thermal Conductivity 55 Shore OO Hardness Silicone Thermal Pad Material
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
The thermal pad material is mainly used for heat conduction between different materials, that is, heat is transferred from high-temperature materials to low-temperature materials, so as to achieve heat dissipation effect and prolong the service life of components. With the improvement of the processing capacity of electronic components and the development to smaller and more compact electronic modules, the demand for heat dissipation is also increasing. The thermal pad material can reliably protect sensitive circuits and components in harsh environments for a long time.
The application characteristics of the thermal pad are very consistent with the emission demand of the power battery, so the thermal conductive silica gel gasket can play a good role in the application of the power battery. Select the thermal pad of the power lithium battery pack of new energy vehicles. Firstly, the thermal conductive silica gel gasket meets the service life of new energy vehicles of more than 8-10 years and the reliability requirements. The thermal conductive silica gel sheet series has a special ultra-thin glass fiber cloth double-layer structure, which increases the operability and tensile strength, and makes the thermal conductive silica gel sheet not easy to be damaged and has a longer service life in the continuous movement environment.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan