Home ProductsThermally Conductive Encapsulant

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

I'm Online Chat Now

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler
Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Large Image :  Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: GF100
Payment & Shipping Terms:
Minimum Order Quantity: 400 ml (200 ml each part)
Packaging Details: 50 ml (25 ml each part)/ 400 ml(200 ml each part)/ 20 kg(10 kg each part)
Delivery Time: 13-15 working days
Payment Terms: T/T

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Description
Product Name: Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Usage Temperature: -40 ℃ ~ 150 ℃
Viscosity/Component A: 4500 Cps Viscosity/Component B: 4500 Cps
Hardness, After Cure: 60(shore Oo) Working Time@25℃: 30 Min
High Light:

Organic Thermally Conductive Encapsulant

,

Thermally Conductive Encapsulant Flame Retardant

,

Flame Retardant Silicone Encapsulant

Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle

 

GF High thermal conductivity silicon encapsulating gum is a room temperature/heating curing and molding organic silicone materials. This kind of two-component elastic silicone potting, designed to protect in harsh conditions of electronic products. High thermal conductivity silicon encapsulating glue used new technology without heating, would be curing. When used according to 1:1 (weight ratio or the volume in the thorough mixing proportion of A and B two components, products will be in A certain time, form of the elasticity of curing buffer material.

 

Thermally Conductive Encapsulant is a low-viscosity two-component silicone potting material. This product has good fluidity, does not produce small molecules during curing, has excellent thermal conductivity and insulation properties after curing, and has no corrosion to various substrates. It is mainly used for potting of electronic components and circuit boards, such as driving power supplies. Sensors, photovoltaic junction boxes, etc., provide protection for electrical/electronic devices and components under severe conditions such as high humidity, extreme temperature, thermal cycle stress, mechanical shock and vibration, mold, dirt, etc., no contact thermal resistance, seamless contact Heat-generating electronic components, heat is conducted from the separation device or the entire PCB to the metal shell or diffusion plate, thereby improving the efficiency and service life of the heat-generating electronic components.

 

 

Product feature

■ Deaeration the mixture under 0.08 MPa for 3 minutes.

■ The temperature influences the curing time: When in too low temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization.
■ Thermal conductivity: 1.0~2.0 W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time

 

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

 

 

Purchasing Information

Packing specification: 50 ml (25 ml each part)/ 400 ml(200 ml each part)/ 20 kg(10 kg each part)

 

Directions for use

• Working time @ 25C: 30 ~ 120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25
C: 4 hours
• Full cure @ 100
C: 5 minutes

 

Storage

Store in a cool, dry, well-ventilated place.

 

Shelf life

Shelf life of the product is 12 months after date of shipment.

 

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Sliver Grey Visual
Density(g/cc) 1.8 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥10.0 ASTM D149
Dielectric Constant(@10mhz) 5.5 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^15 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 0.8 ASTM D5470
Viscosity/Component A (cps) 4500 ASTM D2196
Viscosity/Component B (cps) 4500 ASTM D2196
Hradness,after cure(shore OO) 60 ASTM D22240
Working Time@25℃(min) 30 ISO 9048

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

Send your inquiry directly to us (0 / 3000)