|Product Name:||Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle||Usage Temperature:||-40~150（℃）|
|Viscosity/Component A:||4500(cps)||Viscosity/Component B:||4500(cps)|
|Hardness, After Cure:||60(shore Oo)||Working Time@25℃:||30(min)|
Organic Thermally Conductive Encapsulant,
Thermally Conductive Encapsulant Flame Retardant,
Flame Retardant Silicone Encapsulant
Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle
GF High thermal conductivity silicon encapsulating gum is a room temperature/heating curing and molding organic silicone materials. This kind of two-component elastic silicone potting, designed to protect in harsh conditions of electronic products. High thermal conductivity silicon encapsulating glue used new technology without heating, would be curing. When used according to 1:1 (weight ratio or the volume in the thorough mixing proportion of A and B two components, products will be in A certain time, form of the elasticity of curing buffer material.
Thermally Conductive Encapsulant is a low-viscosity two-component silicone potting material. This product has good fluidity, does not produce small molecules during curing, has excellent thermal conductivity and insulation properties after curing, and has no corrosion to various substrates. It is mainly used for potting of electronic components and circuit boards, such as driving power supplies. Sensors, photovoltaic junction boxes, etc., provide protection for electrical/electronic devices and components under severe conditions such as high humidity, extreme temperature, thermal cycle stress, mechanical shock and vibration, mold, dirt, etc., no contact thermal resistance, seamless contact Heat-generating electronic components, heat is conducted from the separation device or the entire PCB to the metal shell or diffusion plate, thereby improving the efficiency and service life of the heat-generating electronic components.
■ Deaeration the mixture under 0.08 MPa for 3 minutes.
■ The temperature influences the curing time: When in too low temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization.
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications
Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Directions for use
• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Color/Component B||Sliver Grey||Visual|
|Breakdown Voltage(kv/mm)||≥10.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.5||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^15||ASTM D257|
|Thermal conductivity(W/m.K)||0.8||ASTM D5470|
|Viscosity/Component A (cps)||4500||ASTM D2196|
|Viscosity/Component B (cps)||4500||ASTM D2196|
|Hradness,after cure(shore OO)||60||ASTM D22240|
|Working Time@25℃(min)||30||ISO 9048|
Contact Person: Jason Zhan