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Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

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Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal
Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

Large Image :  Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: GF
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

Description
Product Name: Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With OBC Composition: Ceramic Filler + Silicone
Density: 1.8(g/cc) Breakdown Voltage: ≥10(kv/mm)
Thermal Resistance: 0.15 (℃-in2/W)0.1mm@50psi Dielectric Constant: 5.5(@10mhz)
High Light:

Shockproof Electrical Potting Compound

,

Durable Electrical Potting Compound

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OBC Electronics Encapsulation Epoxy

Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With OBC

 

Thermally Conductive Encapsulant is a newly soft insulating material of adhesive compounds. It cures with no heat, no corrosion and little shrinkage. It can be applied to the sealing and pouring of various electronic components, and then forming insulation system. It is suitable for bonded seal of electronic components, power module and control module, which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.

1, Pls put part A and part B in separate container and stir evenly before mixing the two part together.
2, Weight Ratio: part A: part B = 1:1
3, Deaeration the mixture under 0.08 MPa for 3 minutes.
4, The temperature influences the curing time: When in too low temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization.

 

The Thermally Conductive Encapsulant add molding organic silicone sealant, use imported organic silicone as the main material, select the polymer materials as fillers, manufactured elaborately electronic potting glue, glue viscosity is divided into high, middle, low three type, color also can be optional according to customer's demand, and has heat conducting, flame retardant, bonding, sealing, waterproof, potting and encapsulation properties. The fluidity is good before curing. It can seal the narrow gap and play a protective role. After curing, it can be moisture-proof, waterproof and dustproof, and has good resistance to high and low temperatures. It can also be used normally at higher temperatures. In addition, the shockproof effect is also good. As long as the external vibration is not particularly large, it will hardly be affected.

 


Two-part, 1:1 mixing ratio
Medium viscosity Room temperature cure or rapid heat cure
Addition cure system: no cure by-products
Flexible rubber - protects against mechanical shock and thermal cycling stress at components
Excellent dielectric properties

 

Product feature
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time

 

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

 

 

Purchasing Information

Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)

 

Directions for use

• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes

 

Storage

Store in a cool, dry, well-ventilated place.

 

Shelf life

Shelf life of the product is 12 months after date of shipment.

 

Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Sliver Grey Visual
Density(g/cc) 1.8 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥10.0 ASTM D149
Dielectric Constant(@10mhz) 5.5 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^15 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 0.8 ASTM D5470
Viscosity/Component A (cps) 4500 ASTM D2196
Viscosity/Component B (cps) 4500 ASTM D2196
Hradness,after cure(shore OO) 60 ASTM D22240
Working Time@25℃(min) 30 ISO 9048

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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