|Product Name:||Waterproof Thermally Conductive Encapsulant Silicone Sealant For Led Encapsulation||Color:||White|
|Breakdown Voltage:||≥10（kv/mm）||Thermal Resistance:||0.15 (℃-in2/W)0.1mm@50psi|
Industrial Thermally Conductive Encapsulant,
Practical Thermally Conductive Encapsulant,
V-0 Thermal Conductive Silicone Sealant
Waterproof Thermally Conductive Encapsulant Silicone Sealant For Led Encapsulation
Thermally Conductive Encapsulant is a two-component condensation thermal conductive potting adhesive, which can reliably protect sensitive circuits and components for a long time within a wide range of temperature and humidity changes. It has excellent electrical insulation performance, can withstand environmental pollution, and avoid damage to products due to environmental factors such as stress, vibration and humidity. It is especially suitable for products requiring good heat dissipation for potting materials. The product has excellent physical and chemical resistance. After 1:1 mixing, it can be cured at room temperature or heated quickly, with minimal shrinkage, no heat release during the curing process, no solvent or curing by-products, repairable, and can be deeply cured into elastomer.
The double component Silicone Thermally Conductive Encapsulant add molding organic silicone sealant,use imported organic silicone as the main material, select the polymer materials as fillers,manufactured elaborately electronic potting glue, glue viscosity is divided into high, middle, low three type, color also can be optional according to customer's demand, and has heat conducting,flame retardant, bonding, sealing, waterproof, potting and encapsulation properties. Its electrical insulation ability is particularly outstanding, which is also a major reason for the trust of the majority of users. No reaction occurs between electronic components and circuits to reduce the probability of accidents.
Thermally Conductive Encapsulant is a low viscosity flame retardant two-component addition molded silicone thermal conductive potting adhesive, which can be cured at room temperature or by heating. The higher the temperature, the faster the curing. It is made by adding heat conducting material on the basis of ordinary potting silica gel or bonding silica gel. Generally, it is made by excellent manufacturers: it will not produce any by-products in the curing reaction, and can be applied to the surface of PC (poly carbon), PP, ABS, PVC and other materials and metals. It is applicable to heat conduction, insulation, waterproof and flame retardance of electronic accessories, and its flame retardancy shall reach ul94-v0. Comply with EU ROHS directive. The main application fields are the potting of electronic and electrical components and electrical components, as well as the potting of similar temperature sensors.
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications
Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Directions for use
• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Color/Component B||Sliver Grey||Visual|
|Breakdown Voltage(kv/mm)||≥10.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.5||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^15||ASTM D257|
|Thermal conductivity(W/m.K)||0.8||ASTM D5470|
|Viscosity/Component A (cps)||4500||ASTM D2196|
|Viscosity/Component B (cps)||4500||ASTM D2196|
|Hradness,after cure(shore OO)||60||ASTM D22240|
|Working Time@25℃(min)||30||ISO 9048|
Contact Person: Jason Zhan