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Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With LED

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Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With LED

Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With LED
Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With LED Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With LED

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Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: GF100
Payment & Shipping Terms:
Minimum Order Quantity: 400 ml (200 ml each part)
Packaging Details: 50 ml (25 ml each part)/ 400 ml(200 ml each part)/ 20 kg(10 kg each part)
Delivery Time: 13-15 working days
Payment Terms: T/T

Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With LED

Description
Product Name: Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With LED Dielectric Constant: 5.5(@10mhz)
Flammability: V-0 Thermal Conductivity: 0.8 W/m.K
Viscosity/Component A: 4500 Cps Viscosity/Component B: 4500 Cps
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Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With LED

 

GF series thermally conductive potting encapsulant provides thermal conductivity and electrical insulative characteristics delivered in a two part dispensable and easily automated product. Additionally, the GF series provides protection from shock, dust, water, and vibration.
Product features:Thermal conductivity: 1.0~2.0 W/m.K,Electrically insulating
Typical applications:Automotive: OBC, DC/DC Converter, Amplifiers

 

The Thermally Conductive Encapsulant add molding organic silicone sealant, use imported organic silicone as the main material, select the polymer materials as fillers, manufactured elaborately electronic potting glue, glue viscosity is divided into high, middle, low three type, color also can be optional according to customer's demand, and has heat conducting, flame retardant, bonding, sealing, waterproof, potting and encapsulation properties. The fluidity is good before curing. It can seal the narrow gap and play a protective role. After curing, it can be moisture-proof, waterproof and dustproof, and has good resistance to high and low temperatures. It can also be used normally at higher temperatures. In addition, the shockproof effect is also good. As long as the external vibration is not particularly large, it will hardly be affected.


1. High thermal conductivity -- provides the highest thermal conductivity with its viscosity range in the world
2. Low Stress -- exhibits low shrinkage and stress on components as it is curing;low thermal expansion after curing.
3. Highly reliable -- composed of an addition-curing polydimethly siloxane polymer that will not deploymerize when heated in confined spaces.
4. Low Viscosity -- maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials.
5. Environmentally Resistant -- provides excellent thermal shock resistance.
6. Excellent flame retardancy.

 

The double component Silicone Thermally Conductive Encapsulant add molding organic silicone sealant,use imported organic silicone as the main material, select the polymer materials as fillers,manufactured elaborately electronic potting glue, glue viscosity is divided into high, middle, low three type, color also can be optional according to customer's demand, and has heat conducting,flame retardant, bonding, sealing, waterproof, potting and encapsulation properties. Its electrical insulation ability is particularly outstanding, which is also a major reason for the trust of the majority of users. No reaction occurs between electronic components and circuits to reduce the probability of accidents.

 

Product feature
■ Thermal conductivity: 1.0~2.0 W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time

 

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

 

 

Purchasing Information

Packing specification: 50 ml (25 ml each part)/ 400 ml (200 mL each part)/ 20 kg(10 kg each part)

 

Directions for use

• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25
C: 4 hours
• Full cure @ 100
C: 5 minutes

 

Storage

Store in a cool, dry, well-ventilated place.

 

Shelf life

Shelf life of the product is 12 months after date of shipment.

 

Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With LED 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Sliver Grey Visual
Density(g/cc) 1.8 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥10.0 ASTM D149
Dielectric Constant(@10mhz) 5.5 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^15 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 0.8 ASTM D5470
Viscosity/Component A (cps) 4500 ASTM D2196
Viscosity/Component B (cps) 4500 ASTM D2196
Hradness,after cure(shore OO) 60 ASTM D22240
Working Time@25℃(min) 30 ISO 9048

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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