|
Product Details:
|
| Product Name: | High Thermal Conductivity Encapsulating Low Viscosity Heat Conducting Material With Silicon For OBC | Composition: | Ceramic Filler + Silicone |
|---|---|---|---|
| Color: | White | Density: | 1.8(g/cc) |
| Breakdown Voltage: | ≥10 Kv/mm | Usage Temperature: | -40 ℃ ~ 150 ℃ |
| High Light: | Clear Silicone PCB Potting Compound,Silicone PCB Potting Compound,Multipurpose Optically Clear Silicone Encapsulant |
||
High Thermal Conductivity Encapsulating Low Viscosity heat conducting material With Silicon For OBC
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic filler + Silicone | - |
| Color/Component A | White | Visual |
| Color/Component B | Sliver Grey | Visual |
| Density(g/cc) | 1.8 | ASTM D792 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥10.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 5.5 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1015 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 0.8 | ASTM D5470 |
| Viscosity/Component A (cps) | 4500 | ASTM D2196 |
| Viscosity/Component B (cps) | 4500 | ASTM D2196 |
| Hradness,after cure(shore OO) | 60 | ASTM D22240 |
| Working Time@25℃(min) | 30 | ISO 9048 |
Product feature
■ Thermal conductivity: 1.0~2.0 W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time
Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications
Purchasing Information
Packing specification: 50 ml (25 ml each part)/400 ml (200 ml each part)/ 20 kg(10 kg each part)
Directions for use
• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes
Storage
Store in a cool, dry, well-ventilated place.
Shelf life
Shelf life of the product is 12 months after date of shipment.
Contact Person: Jason Zhan
Tel: +8613923884646
