|Product Name:||High Thermal Conductivity Encapsulating Low Viscosity Heat Conducting Material With Silicon For OBC||Composition:||Ceramic Filler + Silicone|
|Breakdown Voltage:||≥10（kv/mm）||Usage Temperature:||-40~150（℃）|
Clear Silicone PCB Potting Compound,
Silicone PCB Potting Compound,
Multipurpose Optically Clear Silicone Encapsulant
High Thermal Conductivity Encapsulating Low Viscosity heat conducting material With Silicon For OBC
GF series thermally conductive potting encapsulant provides thermal conductivity and electrical insulative characteristics delivered in a two part dispensable and easily automated product. Additionally, the GF series provides protection from shock, dust, water, and vibration.
Characteristics and advantages of Thermally Conductive Encapsulant: good thermal conductivity and flame retardancy, low viscosity, good leveling, curing to form a soft rubber, good impact resistance, strong adhesion, insulation, moisture resistance, earthquake resistance, corona resistance, electric leakage resistance and chemical medium resistance. When in use, it has good salt spray resistance and can protect electronic components from salt spray erosion; Water resistance is also good. It can isolate moisture and moisture from damage. In addition, the thermal conductive potting adhesive is an environmental protection product, which is not corrosive to any device, so don't worry.
Thermally Conductive Encapsulant is a low viscosity flame retardant two-component addition molded silicone thermal conductive potting adhesive, which can be cured at room temperature or by heating. The higher the temperature, the faster the curing. It is made by adding heat conducting material on the basis of ordinary potting silica gel or bonding silica gel. Generally, it is made by excellent manufacturers: it will not produce any by-products in the curing reaction, and can be applied to the surface of PC (poly carbon), PP, ABS, PVC and other materials and metals. It is applicable to heat conduction, insulation, waterproof and flame retardance of electronic accessories, and its flame retardancy shall reach ul94-v0. Comply with EU ROHS directive. The main application fields are the potting of electronic and electrical components and electrical components, as well as the potting of similar temperature sensors.
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications
Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Directions for use
• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Color/Component B||Sliver Grey||Visual|
|Breakdown Voltage(kv/mm)||≥10.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.5||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^15||ASTM D257|
|Thermal conductivity(W/m.K)||0.8||ASTM D5470|
|Viscosity/Component A (cps)||4500||ASTM D2196|
|Viscosity/Component B (cps)||4500||ASTM D2196|
|Hradness,after cure(shore OO)||60||ASTM D22240|
|Working Time@25℃(min)||30||ISO 9048|
Contact Person: Jason Zhan