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Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler

Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler
Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler

Large Image :  Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TF
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50 ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Delivery Time: 13-15 working days
Payment Terms: T/T

Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler

Description
Product Name: 3.0W/M.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking Composition: Ceramic Filler + Silicone
Thermal Conductivity: 3.0 W/m.K Viscosity/Component A: 400000 (cps)
Viscosity/Component B: 400000 (cps) Hardness, After Cure: 40 (shore Oo)
High Light:

Multiscene Thermal Conductive Filler

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Anti Aging Thermal Conductive Filler

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3W/MK Liquid Thermal Gap Filler

3.0 W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking

 

TF Series Liquid Gap Filler are two-part, 1:1 ratio, ceramic filled silicone dispensable gap fillers. Curing at room temperature lends itself to high volume automation. Typical applications are where high tolerances are present and designs require reduced mechanical stresses.

 

Thermal Liquid Gap Filler is a soft silicone based thermal gap filling material with high thermal conductivity, low interfacial thermal resistance and good thixotropy.It is filled between the electronic components to be cooled and the radiator/housing, etc., making them in close contact, reducing the thermal resistance, quickly and effectively reducing the temperature of the electronic components, thus prolonging their service life and improving their reliability.Thermal gels can be painted by hand or by dispensing equipment.

 

 

Product feature

1. High thermal conductivity, low thermal resistance, excellent wetting
2. Soft, stress-free, infinitely compressed to a minimum of 0.1 mm
3. No settlement, no flow, can fill any uneven gap
4. Convenient design and application, with automatic glue machine can adjust any thickness size

 

Typical applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays

 

Two-part dispensable gap filler

TF Series Thermal Conductive Gap Filler products are two-component pre-formed thermally conductive silicone products, which mainly meet the requirements of low stress and high compressive modulus when the product is in use, and can realize automatic production; it has good contact with electronic products when assembling. A low contact thermal resistance and good electrical insulation characteristics. The cured thermally gap filler is equivalent to a thermally conductive pad, with good high temperature resistance and aging resistance, and can work for a long time at -40~200℃.

 

Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)

 

Directions for use
• Working hours @ 25
C : 1 hour
• Dry to touch @ 25
C : 1 hour
• Full cure @ 25
C : 12-16 hours
• Full cure @ 100
C : 1 hour

 

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.

 

Multiscene Anti Aging Thermal Conductive Filler , 3W/m.K Liquid Thermal Gap Filler 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Light Bule Visual
Density(g/cc) 3 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470
Viscosity/Component A (cps) 400000 ASTM D2196
Viscosity/Component B (cps) 400000 ASTM D2196
Hradness,after cure(shore OO) 40 ASTM D22240
 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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