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Product Details:
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| Product Name: | 3.0W/m.K Cpu Liquid Cooling Silicone Thermal Paste Gap Filler | Composition: | Ceramic Filler + Silicone |
|---|---|---|---|
| Breakdown Voltage: | ≥7.0（kv/mm） | Usage Temperature: | -40 ℃ ~ 150 ℃ |
| Flammability: | V-0 | Thermal Conductivity: | 3.0 W/m.K |
| High Light: | 3W/m.K Liquid Gap Filler,CPU Liquid Gap Filler,Flame Retardant Thermally Conductive Filler |
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| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic filler + Silicone | - |
| Color/Component A | White | Visual |
| Color/Component B | Light Bule | Visual |
| Density(g/cc) | 3 | ASTM D792 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥7.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.3 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1013 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 3.0 | ASTM D5470 |
| Viscosity/Component A (cps) | 400000 | ASTM D2196 |
| Viscosity/Component B (cps) | 400000 | ASTM D2196 |
| Hradness,after cure(shore OO) | 40 | ASTM D22240 |
Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ High thermal conductivity, low thermal resistance, excellent wetting
■ Low pressure vs. deflection
■ Pre-cured version of thermal gel is fully reworkable Thixotropic/prevents compound run-out
■ Automation and mass production capable
■ Long-term reliability with in-application stability
Typical applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
Two-part dispensable gap filler
TF Series Thermal Conductive Gap Filler products are two-component pre-formed thermally conductive silicone products, which mainly meet the requirements of low stress and high compressive modulus when the product is in use, and can realize automatic production; it has good contact with electronic products when assembling. A low contact thermal resistance and good electrical insulation characteristics. The cured thermally gap filler is equivalent to a thermally conductive pad, with good high temperature resistance and aging resistance, and can work for a long time at -40~200℃.
Purchase information
Packing specification: 50mL(25mL each part) / 400ml(200mL each part)/20kg (10kg each part)
Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour
Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.
Contact Person: Jason Zhan
Tel: +8613923884646
