|Product Name:||Single Part 3W/m.K Silicone Thermal Conductivity Gap Filler For Displays||Composition:||Ceramic Filler + Silicone|
|Breakdown Voltage:||≥5.0（kv/mm）||Usage Temperature:||-40 ℃ ~ 150 ℃|
3W/MK Thermal Conductive Gap Filler,
Displays Thermal Conductive Gap Filler,
Single Thermal Conductive Filler
TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
Product features:One-part dispensable gap filler, Thermal conductivity: 1.0-6.0 W/m.k
Typical applications:Consumer Electronics: Gaming Systems, LCD TVs, Displays
The thermal conductivity gap filler product is generally in the form of a ball, which is between the heat transfer paste and the heat transfer pad. It is similar to the plasticine. It can be directly used or prefabricated into products of different thickness and shapes (manually or by mold) according to needs. The plasticity and softness of the product will not change after use, nor will it solidify, which is convenient for re pasting and repair. The product has good fit and high compression ratio (compression ratio is more than 80%), which can meet the application requirements in complex environments. Typical applications include: filling of uneven heating interface between semiconductor and heat sink, and filling of LED bulb lamp to replace thermal conductive silicone grease that is prone to pollution.
The thermal conductivity of the thermal conductivity gap filler ranges from 1.5w/m*k to 7.9w/m*k, which can be used in electronic devices and has excellent thermal conductivity. Compared with thermal conductive silicone grease, the viscosity of thermal conductivity gap filler is higher and harder than silicone grease. Users can knead it into a certain shape as required and fill it between the electronic components to be cooled and the radiator / shell, so as to make it in close contact, reduce the thermal resistance, and quickly and effectively reduce the temperature of electronic components, so as to prolong the service life of electronic components and improve their reliability.The thermal conductivity gap filler will not be crosslinked (solidified), so it is easy to operate when the radiator needs to be changed or replaced during electronic assembly.
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan