|Product Name:||Single Part 3w/M.K Silicone Thermal Conductivity Gap Filler For LCD TVs||Composition:||Ceramic Filler + Silicone|
|Breakdown Voltage:||≥5.0（kv/mm）||Usage Temperature:||-40~150（℃）|
Heatproof Thermally Conductive Filler,
Single Thermally Conductive Filler,
Anti Corrosion Thermal Gap Filler
Single Part 3w/M.K Silicone Thermal Conductivity Gap Filler For LCD TVs
TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
thermal conductivity gap filler is a kind of high-performance mud like thermal conductive material. It is made of silica gel as the matrix and filled with a variety of high-performance ceramic powders. The thermal conductivity gap filler has the characteristics of high thermal conductivity, low thermal resistance, good adhesion on heat dissipation parts, long-term non drying, insulation, automatic filling of gaps, limited increase of limited contact area, infinite compression, etc. It is mainly used in UAV, automobile industry, communication industry, power supply, consumer electronics, etc.
thermal conductivity gap filler inherits the advantages of silica gel material, such as good affinity, weather resistance, high and low temperature resistance, and good insulation. At the same time, it has strong plasticity and can meet the filling of uneven interfaces, and can meet the heat transfer needs of various applications.
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■The thermal conductivity gap filler has ultra-low thermal resistance, which can optimize the heat dissipation performance of the product.
■The research and design is convenient. The thermal conductivity gap filler is mud like and permanent self-adhesive. The product design does not need to specially consider the limitations of product size and tolerance, and can be flexibly designed according to the effect.
■Convenience of purchase management. One model and specification of thermal conductivity gap filler can meet the needs of multiple models and products, greatly simplifying the purchase management and storage management.
■The thermal conductivity gap filler can realize process automation. The glue dispenser independently developed by sirnice or purchased by the market can be used to realize the automatic glue dispensing process, which greatly improves the construction efficiency, reduces the labor cost and time cost, and optimizes the stability of the product.
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan