|Product Name:||Single Part 3w/M.K Silicone Thermal Conductivity Gap Filler For LEDs||Composition:||Ceramic Filler + Silicone|
|Usage Temperature:||-40~150（℃）||Thermal Conductivity:||3.0（W/m.K）|
Anticorrosive Thermal Conductive Gap Filler,
Anti Vibration Thermal Conductive Gap Filler,
Multipurpose Thermally Conductive Gap Filler
Single Part 3w/M.K Silicone Thermal Conductivity Gap Filler For LEDs
TM Series Single Part thermal conductivity gap filler is a kind of high-performance thermal conductive gel. It is made of silica gel as the matrix and filled with a variety of high-performance ceramic powders. The thermal conductive gap filler has the characteristics of high thermal conductivity, low thermal resistance, good adhesion on heat dissipation parts, insulation, automatic filling of gaps, maximum increase of limited contact area and infinite compression.
The thermal conductive gap filler is soft and has good surface affinity. It can be compressed to a very low thickness, which significantly improves the heat transfer efficiency. At least it can be compressed to 0.1mm. At this time, the thermal resistance can be 0.08 ℃ · in2/w - 0.3 ℃ · in2/w, which can reach the performance of some silicone grease. In addition, the thermal conductive gap filler has almost no hardness and will not produce internal stress on the equipment after use.
Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
■ Thermal conductivity: 1.0-6.0 W/m.k
■ The thermal conductivity gap filler has ultra-low thermal resistance, which can optimize the heat dissipation performance of the product.
■ The research and design is convenient. The thermal conductivity gap filler is mud like and permanent self-adhesive. The product design does not need to specially consider the limitations of product size and tolerance, and can be flexibly designed according to the effect.
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan