|Composition:||Ceramic Filler + Silicone||Product Name:||Single Part 3w/M.K Silicone Thermal Conductivity Gap Filler For Power Supplies|
|Thermal Conductivity:||3.0（W/m.K）||Breakdown Voltage:||≥5.0（kv/mm）|
|Usage Temperature:||-40~150（℃）||Dielectric Constant:||7.3（@10mhz）|
RoHS Thermally Conductive Filler,
Tablets Thermally Conductive Filler,
flame retardant Liquid Gap Filler
Single Part 3w/M.K Silicone Thermal Conductivity Gap Filler For Power Supplies
TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
Thermal conductive gap filler is a kind of colloidal material made of thermal conductive material and bonding material through appropriate processing technology. It has the advantages of extremely low deformation force and good plasticity. It can be applied to irregular narrow spaces. At the same time, it has good wettability and can cover micro uneven surfaces, so as to cooperate with the parts to fully contact and improve the heat conduction effect.
Thermal conductive gap filler is widely used as heat transfer enhancement material in the field of industrial heat tracing and heat exchange. Its main function is to increase the heat conduction area and establish a heat transfer channel with high efficiency and low thermal resistance by using it in the heat tracing and heat exchange device, so as to improve the heat transfer efficiency, reduce energy consumption and prevent the material from freezing and crystallizing due to insufficient heat tracing temperature and blocking the process pipeline. Moreover, the thermal conductive gap filler can effectively improve the heat transfer uniformity of the heat tracing and heat exchange device, especially in the high-temperature heat tracing system and electric heat tracing system, so as to prevent the material denaturation caused by local overheating of the heated medium.
■ Thermal conductivity: 1.0-6.0 W/m.k
■High thermal conductivity, good plasticity, electrical insulation and stability, good high and low temperature resistance
■Water resistant, non curing, excellent wettability, reduced thermal resistance of contact surface, no corrosion to metal materials (copper, aluminum, steel)
■Extremely low volatilization loss, non drying, non melting, good material adaptability and large temperature range (-60 ∽ +200 ℃)
■Excellent thermal conductivity,
■Extremely low thermal resistance, better heat transfer,
■Effectively moisten the contact surface, improve heat dissipation,
■Safety, environmental protection, fire prevention and flame retardancy.
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan