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AOK Multipurpose Thermal Conductive Gap Filler For Networking

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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AOK Multipurpose Thermal Conductive Gap Filler For Networking

AOK Multipurpose Thermal Conductive Gap Filler For Networking
AOK Multipurpose Thermal Conductive Gap Filler For Networking AOK Multipurpose Thermal Conductive Gap Filler For Networking

Large Image :  AOK Multipurpose Thermal Conductive Gap Filler For Networking

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TM300
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

AOK Multipurpose Thermal Conductive Gap Filler For Networking

Description
Product Name: Silicone Thermal Conductive Gap Filler With High Thermal Conductive Up To 3W Composition: Ceramic Filler + Silicone
Density: 2.9(g/cc) Usage Temperature: -40~150(℃)
Dielectric Constant: 7.3(@10mhz) Thermal Conductivity: 3.0(W/m.K)
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AOK Thermal Conductive Gap Filler

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Multipurpose Thermal Conductive Gap Filler

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Networking Thermal Gap Filler

Silicone Thermal Conductive Gap Filler With High Thermal Conductive Up To 3W

 

TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.

 

Thermal conductivity gap filler for Automotive Applications: Designed for demanding, high reliability environments, provide form-in-place functionality via moisture or thermal cure. Upon cure, the one-part thermal gels provide a soft, thermally conductive material capable of reducing air voids and gaps. It have been uniquely designed to deliver highly reliable vertical gap stability even in an uncured state. With no mixing required and good dispensing efficiency, It enable high throughput mass production while providing the assurance of reliability due to their cure-in-place final modulus. These Henkel thermal gels have passed severe hazing and fogging testing, making them exceptionally well-suited for optical systems such as ADAS cameras and lidars.

 

The thermal conductive gap filler in the silicone series products can be applied to the electronic control unit of new energy vehicles. After curing, it has a very high compression ratio, so as to ensure that there is no air residue between the gaps and does not affect the heat transfer. It is the core heat dissipation material of the automotive control system.

 

 

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

 

Purchasing information
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail

 

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

 

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

 

 

AOK Multipurpose Thermal Conductive Gap Filler For Networking 0

 

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color Green Visual
Density(g/cc) 2.9 ASTM D792
Extrudability(g/s) 5.0 ISO9048
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥5.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^14 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

Send your inquiry directly to us (0 / 3000)