|Product Name:||Silicone Thermal Conductive Gap Filler With High Thermal Conductive Up To 3W||Composition:||Ceramic Filler + Silicone|
|Dielectric Constant:||7.3（@10mhz）||Thermal Conductivity:||3.0（W/m.K）|
AOK Thermal Conductive Gap Filler,
Multipurpose Thermal Conductive Gap Filler,
Networking Thermal Gap Filler
Silicone Thermal Conductive Gap Filler With High Thermal Conductive Up To 3W
TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
Thermal conductivity gap filler for Automotive Applications: Designed for demanding, high reliability environments, provide form-in-place functionality via moisture or thermal cure. Upon cure, the one-part thermal gels provide a soft, thermally conductive material capable of reducing air voids and gaps. It have been uniquely designed to deliver highly reliable vertical gap stability even in an uncured state. With no mixing required and good dispensing efficiency, It enable high throughput mass production while providing the assurance of reliability due to their cure-in-place final modulus. These Henkel thermal gels have passed severe hazing and fogging testing, making them exceptionally well-suited for optical systems such as ADAS cameras and lidars.
The thermal conductive gap filler in the silicone series products can be applied to the electronic control unit of new energy vehicles. After curing, it has a very high compression ratio, so as to ensure that there is no air residue between the gaps and does not affect the heat transfer. It is the core heat dissipation material of the automotive control system.
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan