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Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing
Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Large Image :  Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TM
Payment & Shipping Terms:
Minimum Order Quantity: 400 ml (200 ml each part)
Packaging Details: 50 ml (25 ml each part)/400 ml (200 ml each part)/ 20 kg (10 kg each part)
Delivery Time: 13~15 working days
Payment Terms: T/T

Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Description
Product Name: Single Part Silicone Thermal Conductive Gap Filler With Room Temperature Curing Composition: Ceramic Filler + Silicone
Breakdown Voltage: ≥5.0 Kv/mm Dielectric Constant: 7.3(@10mhz)
Flammability: V-0 Thermal Conductivity: 3.0 W/m.K
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Multiscene Thermally Conductive Gap Filler

Single Part Silicone Thermal Conductive Gap Filler With Room Temperature Curing

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color Green Visual
Density(g/cc) 2.9 ASTM D792
Extrudability(g/s) 5.0 ISO9048
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥5.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470

 

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.K
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

 

Purchasing information
Packing specification: 300 ml Cartridge/1Kg Jar/20 Kg Pail

 

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

 

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

 

Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing 0

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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