|Product Name:||Green Silicone Thermal Conductive Gap Filler With Aging Resistance||Composition:||Ceramic Filler + Silicone|
|Usage Temperature:||-40~150（℃）||Thermal Resistance:||0.3 (℃-in2/W)0.1mm@50psi|
Heatproof Conductive Gap Filler,
3W/MK Conductive Gap Filler,
Aging Resistant Thermal Filler
Green Silicone Thermal Conductive Gap Filler With Aging Resistance
TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
Compared with the thermal conductive gasket, the Thermal conductivity gap filler is softer and has better surface affinity. It can be compressed to a very low thickness to significantly improve the heat transfer efficiency. At least it can be compressed to 0.1mm. At this time, the thermal resistance can be 0.08 ℃ · in2/w – 0.3 ℃ · in2/w, which can reach the performance of some silicone grease. In addition, the Thermal conductivity gap filler has almost no hardness and will not generate internal stress on the equipment after use.
Thermal conductivity gap filler is easier to operate than thermal conductive silicone grease. The general use of silicone grease is screen or steel plate printing, or direct brushing, which is very unfriendly to users and the environment. Because of its certain fluidity, it can not be used in occasions with a thickness of more than 0.2mm. The Thermal conductivity gap filler can be arbitrarily shaped into the desired shape, which can ensure good contact for uneven PCB boards and irregular devices (such as batteries, component corners, etc.). The Thermal conductivity gap filler has certain adhesion, and will not have the problems of oil production and drying. It has certain advantages in reliability.
The Thermal conductivity gap filler can be directly weighed and used. The commonly used continuous use mode is the dispensing machine, which can realize fixed-point quantitative control, save labor and improve production efficiency.
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan