|Product Name:||0.25 Mm Thickness 2W/m.K Green Silicone Free Thermal Pad For Telecommunications||Color:||Green|
|Thickness:||1.0~10.0 Mm||Density:||2.9 G/cc|
|Breakdown Voltage:||≥6.0 Kv/mm||Thermal Conductivity:||2.0±0.1 W/m.K|
0.25mm Silicone Free Thermal Pad,
2W Silicone Free Thermal Pad,
Telecommunications Thermal Gap Pad
Certain applications require the cleanliness that only a silicone free gap filler can provide. When need arises, TP SF Series has you covered. With two options TP 200SF and TP 300SF providing 2.0 W/m.K and 3.0 W/m.K thermal conductivity, TP SF Series has it covered.
Product features:Silicone Free Gap Filler Pad,2.0 and 3.0 W/mK options.
Typical applications:Silicon Sensitive Components, Fiber Optics
Most thermal conductive silicone pads in the market are made of silicone rubber and thermal conductive fillers. In the long-term use of silicone rubber, especially in high temperature environment, there will be some low molecular silane molecules precipitated, which cannot be applied in medical, electronic, optical communication and other fields with high requirements for equipment environment. The Silicone Free Thermal Pad uses olefin or polyurethane as the base material, adds thermal conductive filler, and does not use silicone rubber, so as to avoid the precipitation of small molecules and will not affect precision electronic devices.
Compared with the traditional thermal conductive gasket, the Silicone Free Thermal Pad has the same excellent thermal conductivity and also has the advantage that the traditional thermal conductive gasket lacks - no silicone oil (which can be called no low molecular siloxane content), so it will not cause volatilization and pollution. Compared with traditional thermal conductive gaskets, non silicon thermal conductive gaskets have very important characteristics, especially in silicon sensitive industries such as optical industry and medical equipment.
With the popularization of the concept of environmental protection all over the world, "green products" have to be used in an increasing proportion, which has also given the Silicone Free Thermal Pad, a green and pollution-free heat conducting material, a broad space to be used.
■ Thermal conductivity:2.0,3.0 W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
|Hardness(shore oo)||45±5||ASTM D2240|
|Breakdown Voltage(kv/mm)||≥6.0||ASTM D149|
|Thermal conductivity(W/m.K)||2.0||ASTM D5470|
Contact Person: Jason Zhan