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Product Details:
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| Composition: | Acrylate | Color: | Green |
|---|---|---|---|
| Thickness: | 1.0~10.0 (mm) | Density: | 2.9(g/cc) |
| Hardness: | 45±5(Shore OO) | Usage Temperature: | -40~150（℃） |
| Breakdown Voltage: | ≥6.0（kv/mm） | Flammability: | V-1 |
| Thermal Conductivity: | 2.0±0.1（W/m.K） | ||
| High Light: | 2.9g/CC Silicone Free Thermal Pad,Heatproof Silicone Free Thermal Pad,Weather Resistant CPU GPU Thermal Pad |
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2W/m.K Thermal Conductivity Green Soft Silicone Free Thermal Pad For Heat-Sink GPU
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Acrylate | - |
| Color | Green | Visual |
| Thickness(mm) | 0.5-10.0 | ASTM D374 |
| Density(g/cc) | 2.9 | ASTM D792 |
| Hardness(shore oo) | 45±5 | ASTM D2240 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥6.0 | ASTM D149 |
| Flammability | V-1 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 2.0 | ASTM D5470 |
Product feature
■ Thermal conductivity: 2.0,3.0W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.
Typical applications
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
Purchase information
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
Contact Person: Jason Zhan
Tel: +8613923884646
