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3W/MK Multipurpose Thermal Conductive Pad Heatsink For Networking

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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3W/MK Multipurpose Thermal Conductive Pad Heatsink For Networking

3W/MK Multipurpose Thermal Conductive Pad Heatsink For Networking
3W/MK Multipurpose Thermal Conductive Pad Heatsink For Networking 3W/MK Multipurpose Thermal Conductive Pad Heatsink For Networking

Large Image :  3W/MK Multipurpose Thermal Conductive Pad Heatsink For Networking

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP300
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

3W/MK Multipurpose Thermal Conductive Pad Heatsink For Networking

Description
Product Name: Low Thermal Resistance 3W/mK Thermal Conductive Pad For Networking And Telecommunications Dielectric Constant(@10mhz): 7.3
Color: Light Blue Volume Resistivity(Ω.cm): 10^13
Density: 3.0 (g/cc) Hardness: 40 (Shore OO)
High Light:

3W/MK Thermal Conductive Pad

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Networking Thermal Conductive Pad

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Multipurpose Thermal Conductive Pads Heatsink

Low thermal resistance 3W/mK thermal Conductive pad for Networking and Telecommunications

 

TP300 is recommended for low-stress applications that require a high thermally conductive interface material. It is ultra-soft for low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack up tolerances. Naturally tacky, it requires additional adhesive coating by the actual condition.

Product Description
1.NKS Soft Thermal Conductive Silicon Pad is a kind of thermal interface with high performance. It is soft, self-sticky and elastic.
2.It can fill the gap between heat-generating components and heat sink, metal mechanism and shell or other cooling devices.
3.The heat can be transferred out speedily so as to improve the electronic components' working efficiency and prolong the life-span of equipments.

 

TP300 Thermal conductive pad is high-performance,thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment,and heat sink or product outer coving. With nice stickiness,flexibility, good compression performance and excellent heat conductivity designed for it,it makes the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.

 

Thermal conductive silicone gap pad is specially designed for the purpose of high performance thermal conductivity.
Standard size: 400mm*200mm, according to customer needs to cut the shapes.
Basic thickness 0.15~20mm, special thickness can be customized.

The product itself is slightly viscous, if need to strengthen the adhesive can be according to customer's requirement.
Product color is mass production, if need special color can be adjusted to the actual situation.

 

Product feature


■ Thermal conductivity: 3.0W/mK
■ Soft and highly compliant
■ High heat transfer efficiency, low thermal resistance, stable performance
■ High and low temperature resistance, good compatibility;
■ High heat transfer efficiency, low thermal resistance, stable performance
■ Excellent electrical insulation to protect electronic equipment

 

Typical applications


■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCDs, and Graphic Cards

 

Purchase information:

 

3W/MK Multipurpose Thermal Conductive Pad Heatsink For Networking 0

 

 

 

3W/MK Multipurpose Thermal Conductive Pad Heatsink For Networking 1

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Light Blue Visual
Thickness(mm) 0.3~10.0 ASTM d374
Density(g/cc) 3.0 ASTM D792
Hardness(shore oo) 40 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥6.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

Send your inquiry directly to us (0 / 3000)