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Product Details:
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| Product Name: | Low Thermal Resistance 3W/mK Thermal Conductive Pad For Networking And Telecommunications | Dielectric Constant（@10mhz）: | 7.3 |
|---|---|---|---|
| Color: | Light Blue | Volume Resistivity（Ω.cm）: | 10^13 |
| Density: | 3.0 (g/cc) | Hardness: | 40 (Shore OO) |
| High Light: | 3W/m.K Thermal Conductive Pad,Networking Thermal Conductive Pad,Multipurpose Thermal Conductive Pads Heatsink |
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| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Light Blue | Visual |
| Thickness(mm) | 0.3~10.0 | ASTM d374 |
| Density(g/cc) | 3.0 | ASTM D792 |
| Hardness(shore oo) | 40 | ASTM D2240 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥6.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.3 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1013 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 3.0 | ASTM D5470 |
Product feature
■ Thermal conductivity: 3.0W/m.K
■ Soft and highly compliant
■ High heat transfer efficiency, low thermal resistance, stable performance
■ High and low temperature resistance, good compatibility;
■ High heat transfer efficiency, low thermal resistance, stable performance
■ Excellent electrical insulation to protect electronic equipment
Typical applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCDs, and Graphic Cards
Purchase information:
Contact Person: Jason Zhan
Tel: +8613923884646
