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1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

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1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable
1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable 1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

Large Image :  1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP300
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

Description
Product Name: 1.5mm Thickness 3.0W Thermal Conductivity Pad Cooling Gap Filler For High-speed Hard Drive Composition: Ceramic Filler + Silicone
Thickness: 0.5~10.0(mm) Density: 3.0 (g/cc)
Hardness: 40 (Shore OO) Usage Temperature: -40~150(℃)
High Light:

1.5mm Heatsink Cooling Pad

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3W Heatsink Cooling Pad

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Heatsink Cooling Thermal Conductive Silicone Pad

1.5mm Thickness 3.0W Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive

 

TP 300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics. TP 300 can meet the design needs of numerous design requirements and specifications. TP 300 will provide the innate thermal requirements your design needs without over stressing the components or cases.
Product features:Soft and highly compliant, Naturally tacky, easing application
Typical applications:Industrial: LEDs, Power Supplies and Conversion

 

TP300 Thermal conductive pad has good compressibility, insulation, especially suitable for the use of transfer heat crack, can fill the gap, between the cooling parts and heating parts can have good heat transfer, and also can have shock absorption, and sealing effect, can reach the design requirements of equipment miniaturization and ultra-thin, is extremely practical and manufacturability of a product.

Thermal Conductivity :3.0W/m.K
Standard size:200mm×400mm,Thickness:0.5—10.0mm
Thermal silicon pad can be coated with adhesive, insulating cloth, copper foil, aluminum foil on one side or both sides.
can be processed into various specifications and any kinds of shapes according to customers’ demands.

 

TP300 is a compliant thermal gap filler designed to provide moderate thermal performance. The pad is low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. TP300 is easy handling and converting process and reusable special property.

 

Product feature


■ Thermal conductivity: 3.0W/mK
■ Soft and highly compliant
■ Naturally tacky, easing application
■ Low pressure versus deflection
■ High heat transfer efficiency, low thermal resistance, stable performance
■ Excellent electrical insulation to protect electronic equipment

 

Typical applications


■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCDs, and Graphic Cards

 

Purchase information:

 

1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable 0

 

 

 

1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable 1

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Light Blue Visual
Thickness(mm) 0.3~10.0 ASTM d374
Density(g/cc) 3.0 ASTM D792
Hardness(shore oo) 40 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥6.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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