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Product Details:
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| Product Name: | Green Silicone High Thermal Conductive Pad With 5.0w For Cpu Thermal Gap Filler | Composition: | Ceramic Filler + Silicone |
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| Color: | Dark Green | Thickness: | 0.5~12.0(mm) |
| Density: | 3.2±0.1 (g/cc) | Hardness: | 50±5 (Shore OO) |
| Usage Temperature: | -40~150（℃） | ||
| High Light: | RoHS Heat Sink Rubber Pads,Ultrasoft Heat Sink Rubber Pads,Silicone Thermal Pad For CPU GPU Heatsink |
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Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler
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Attribute |
Value |
Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Dark green | Visual |
| Thickness(mm) | 1.0~6.0 | ASTM D374 |
| Density(g/cc) | 3.2±0.1 | ASTM D792 |
| Hardness(shore oo) | 50±5 | ASTM D2240 |
| Usage Temperature(℃) | -40~200 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥6.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.4 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1010 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 5.0±0.3 | ASTM D5470 |
Product feature
■ Thermal conductivity: 5.0 W/m.k
■ Naturally tacky, easing application
■ Low pressure versus deflection
■ Excellent, high volume applications
■ Elevated Temperature Resistance
Typical applications
■ Networking and Telecommunications
■ IT: BGA, ASIC, VRM, high speed storage
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■Consumer Electronics: Gaming Systems, LCDs, and Graphic Cards
Purchase information:
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
Contact Person: Jason Zhan
Tel: +8613923884646
