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Product Details:
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| Product Name: | 1.2 W/m.k Thermal Conductivity 10.0 Mm Thickness Ultra Soft Thermal Conductive Pad | Thermal Conductivity: | 1.2 W/m.K |
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| Thickness: | 0.5~10.0 Mm | Density: | 2.3 G/cc |
| Hardness: | 20±5 (Shore OO) | Usage Temperature: | -40 ℃~150 ℃ |
| High Light: | 1.2W/Mk Thermal Conductive Pad,Ultrasoft Thermal Conductive Pad,10mm Thermal Pad Thermal Conductivity |
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| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Pink | Visual |
| Thickness (mm) | 0.5~12.0 | ASTM d374 |
| Density (g/cc) | 2.3 | ASTM D792 |
| Hardness (Shore OO) | 20±5 | ASTM D2240 |
| Tensile Strength(kn/m) | 0.4 | ASTM D624 |
| Elongation % | 52 | ASTM D412 |
| Usage Temperature(℃) | -40~150 | - |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥6.5 | ASTM D149 |
| Dielectric Constant(@1mhz) | 5.3 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1012 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 1.2±0.1 | ASTM D5470 |
Typical applications:
Purchase information:
Contact Person: Jason Zhan
Tel: +8613923884646
