|Product Name:||Low Volatility High Thermal Conductivity Silicone Pad For Industrial Switch||Composition:||Ceramic Filler + Silicone|
|Tensile Strength:||0.4（kn/m）||Usage Temperature:||-40~150（℃）|
Silicone Thermal Conductive Pad,
Anti Interfere Thermal Conductive Pad,
Industrial High Conductivity Thermal Pad
Low Volatility High Thermal Conductivity Silicone Pad For Industrial Switch
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/ mK, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications.
The industrial switch is selected in the industrial environment because of its excellent communication characteristics and strong anti-magnetic and anti-interference ability. It is well known that the industrial environment is very bad. In addition, the continuous operation of the industrial switch is very easy to cause the phenomenon that the temperature of the industrial switch is too high. In addition to the components with a wide temperature range selected by the product itself, the heat dissipation design of the switch is also paid more and more attention.With the higher and higher requirements of the system switching capacity, the power consumption of a single switching chip is also higher and higher, and it is the "heart" of the switch. Due to the high power consumption, the thermal resistance of the heat sink in specific occasions needs to be relatively low. In addition, special protective measures should be taken for the switching chip to prevent overheating.
The low volatile and high thermal conductive pad is mainly used for heat conduction and heat dissipation between the main board and the radiator. The main purpose of selecting the thermal conductivity silicon pad is to reduce the contact thermal resistance between the heat source surface and the contact surface of the radiator. The thermal conductivity silicon pad can well fill the gap between the contact surface. With the supplement of the thermal conductivity silicon pad, the contact surface between the heat source and the radiator can be more fully contacted, greatly reducing the temperature difference between the chip and the product shell, Thus, the chip can work in a safe temperature range. The heat dissipation system of industrial switch requires scientific and reasonable layout of components such as thermal conductive pad, heat sink, fan and CPU, so as to ensure good heat conduction and heat dissipation and improve the stability of the switch.
|Composition||Ceramic Filler + Silicone||-|
|Thickness (mm)||0.5~12.0||ASTM d374|
|Density (g/cc)||2.3||ASTM D792|
|Hardness (Shore OO)||20±5||ASTM D2240|
|Tensile Strength(kn/m)||0.4||ASTM D624|
|Elongation %||52||ASTM D412|
|Breakdown Voltage(kv/mm)||≥6.5||ASTM D149|
|Dielectric Constant(@1mhz)||5.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^12||ASTM D257|
|Thermal conductivity(W/m.K)||1.2±0.1||ASTM D5470|
Contact Person: Jason Zhan