|Product Name:||TP 120 Series 1.2 W/m.K Thermal Conductivity Pad For Electronics Heat Transfer||Composition:||Ceramic Filler + Silicone|
|Density:||2.3 G/cc||Hardness:||20±5 (Shore OO)|
Multipurpose Heat Sink Thermal Pad,
Practical Heat Sink Thermal Pad,
1.2W/MK Silicone Heat Sink Pad
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/m.K, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications. thermal conductivity pad is a thermal conductive medium material synthesized by special process with silica gel as the base material and metal oxide and other auxiliary materials. In the industry, it is also known as thermal conductive silica gel pad, thermal silicon film, soft thermal conductive pad, thermal conductive silica gel pad and so on.
Thermal pad is a typical thermal interface material that effectively transmits heat generated from heat sources inside various devices such as electronic devices and automobiles. It is a silicone based product with excellent heat resistance and electrical insulation properties. The operating temperature of this product is from -45 to 200 degree with excellent thermal performance and compliance, which can meet the customer needs.
Thermal Conductive Silicon Pad is a kind of thermal interface with high performance. It is soft, self-sticky and elastic. It can fill the gap between heat-generating components and heat sink, metal mechanism and shell or other cooling devices. The heat can be transferred out speedily so as to improve the electronic components' working efficiency and prolong the life-span of equipments.
|Composition||Ceramic Filler + Silicone||-|
|Thickness (mm)||0.5~12.0||ASTM d374|
|Density (g/cc)||2.3||ASTM D792|
|Hardness (Shore OO)||20±5||ASTM D2240|
|Tensile Strength(kn/m)||0.4||ASTM D624|
|Elongation %||52||ASTM D412|
|Breakdown Voltage(kv/mm)||≥6.5||ASTM D149|
|Dielectric Constant(@1mhz)||5.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^12||ASTM D257|
|Thermal conductivity(W/m.K)||1.2±0.1||ASTM D5470|
Contact Person: Jason Zhan