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Anticorrosive PC Thermal Pad

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

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Anticorrosive PC Thermal Pad

Anticorrosive PC Thermal Pad
Anticorrosive PC Thermal Pad Anticorrosive PC Thermal Pad

Large Image :  Anticorrosive PC Thermal Pad

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Anticorrosive PC Thermal Pad

Description
Product Name: Ultra Soft Thermal Pad With 1.0w Thermal Conductive Gasket Of Battery Pack Composition: Silicone And Reinforced Fiberglass
Thermal Conductivity(W/m.K): 1.0 Thickness: 0.5~12.0 (mm)
Dielectric Constant(@10mhz): 5.7 Hardness: 30±5(Shore OO)
High Light:

Anticorrosive PC Thermal Pad

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Ultrasoft PC Thermal Pad

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1W Gap Pad Thermal Conductivity

Ultra Soft Thermal Pad High Mechanical Strength with 1.0w thermal conductivity

 

UTP series thermal pad is made of soft silica gel thermal conductive material, which has the characteristics of good thermal conductivity, insulation, softness and elasticity. It is placed between the power heating device and the heat dissipation structure to effectively transfer the heat generated by the power module to the heat dissipation components to realize the heat dissipation of the system. It has self-adhesive property and is easy to apply without additional back glue. It can be cut into any size and shape according to the requirements of application environment to meet different design needs.

 

 

They are ultra soft and have good resilience,so effectively exclude air from the contact interface. The products are naturally tacky,can be die-cut into various shapes,easy to operate.

 

thermal pad is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap, open the heat channel between the heating part and the heat dissipation part, effectively improve the heat transfer efficiency, and also play the role of insulation, shock absorption and sealing. It can meet the design requirements of miniaturization and ultra-thin equipment. It is an excellent heat conduction filling material with great processability and usability, and wide thickness application range.

 

Product feature:
■ Thermal Conductivity:1.0 W/ mK
■ Ultra soft and highly compliant
■ Naturally tacky on one side
thermal silicone sheet with shock absorption and sound absorption effect;
■ High breakdown voltage
The main purpose of the thermal conductive silica gel piece is to reduce the thermal resistance generated between the heat source surface and the contact surface of the heat dissipation device. The thermal conductive silica gel piece can fill the gap of the contact surface well.
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

Anticorrosive PC Thermal Pad 0

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

Anticorrosive PC Thermal Pad 1

 

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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