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2.5G/CC CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

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The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

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2.5G/CC CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling

2.5G/CC CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling
2.5G/CC CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling 2.5G/CC CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling

Large Image :  2.5G/CC CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

2.5G/CC CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling

Description
Product Name: Ultra Soft Thermal Pad 1.5mm Thickness Silicone Rubber Adhesive Cooling Laptop Thermal Pad Composition: Reinforced Fiberglass
Color: White Tensile Strength(KN/m): 2.5
Density: 2.5(g/cc) Hardness: 30±5(Shore OO)
High Light:

2.5g/Cc Ultra Soft Thermal Pad

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CPU Ultra Soft Thermal Pad

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heatproof Cooling Thermal Pad

Ultra Soft thermal pad 1.5mm thickness silicone rubber adhesive cooling laptop thermal pad

 

UTP series products are made by using silica gel and thermal conductive ceramic filler, adding glass fiber cloth as reinforcement material, and processed by special technology. With single-sided self-adhesive type, anti puncture and high breakdown voltage, it is a very soft thermal pad with excellent compressibility. It can be in close contact with electronic components, effectively reduce the interface resistance, and has excellent thermal conductivity.

 

thermal pad are used for filling the two contact surfaces.They are ultra soft and have good resilience, so effectively exclude air from the contact interface. The products are naturally tacky,can be die-cut into various shapes,easy to operate. Our products have passed 1000 hours cold and hot shock test,1000 hours double 85 test,1000 hours high temperature aging test,Committed to providing more reliable heat conduction solutions for automobile, communication, security and other industries.

 

Super soft, with a little sticky, good thermal conductivity easy to cut into small, and feels like leather mud.

 

Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

 

Product feature:
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
The thermal conductivity of the thermal silica gel sheet is adjustable and the thermal stability is better;

 

Typical applications:
■ Networking and Telecommunications
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

2.5G/CC CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling 0

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

 

2.5G/CC CPU Ultra Soft Thermal Pad Heatproof For Laptop Cooling 1

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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