|Product Name:||Ultra Soft Thermal Pad||Composition:||Ceramic Filler, Silicone, And Reinforced Fiberglass|
|Color:||White And Brick Red||Thickness:||0.5~12.0 (mm)|
Anti Interfere Ultra Soft Thermal Pad,
LED Ultra Soft Thermal Pad,
1W/MK Gap Filler Pads
UTP 100 is an extremely soft gap filler pad with a fiberglass reinforced liner, on one side . This combination allows for high breakdown voltage and cut through resistance, while providing the desirable low contact resistance and tolerance pickup of gap filling pads . UTP 100 versatility lends itself to a multitude of designs.
UTP series thermal pad is made of soft silica gel thermal conductive material, which has the characteristics of good thermal conductivity, insulation, softness and elasticity. It is placed between the power heating device and the heat dissipation structure to effectively transfer the heat generated by the power module to the heat dissipation components to realize the heat dissipation of the system. It has self-adhesive property and is easy to apply without additional back glue. It can be cut into any size and shape according to the requirements of application environment to meet different design needs.
thermal pad is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap, open the heat channel between the heating part and the heat dissipation part, effectively improve the heat transfer efficiency, and also play the role of insulation, shock absorption and sealing. It can meet the design requirements of miniaturization and ultra-thin equipment. It is an excellent heat conduction filling material with great processability and usability, and wide thickness application range.
Product features:Thermal Conductivity:1.0W/mK,Ultra Soft, Reinforced Gap Filler Pad
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ The thermal conductivity of the thermal silica gel sheet is adjustable and the thermal stability is better;
■ thermal silicone sheet on the structure of the process difference bridge, reduce the process difference requirements of the radiator and heat dissipation structure;
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
|Composition||Ceramic Filler, Silicone, and Reinforced Fiberglass||-|
|Color||White and Brick Red||Visual|
|Hardness(shore oo)||30±5||ASTM D2240|
|Tensile Strength(KN/m)||2.5||ASTM D624|
|Breakdown Voltage(kv/mm)||≥7.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.7||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^13||ASTM D257|
|Thermal conductivity(W/m.K)||1.0±0.1||ASTM D5470|
Contact Person: Jason Zhan