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Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin

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China Shenzhen Aochuan Technology Co., Ltd certification
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Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin

Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin
Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin

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Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin

Description
Dielectric Constant(@10mhz): 5.7 Breakdown Voltage(kv/mm): 7.0
Product Name: Ultra Soft Thermal Pad With 1.0w Thermal Conductivity Low Volatility Gap Filler Composition: Ceramic Filler, Silicone, And Reinforced Fiberglass
Hardness: 30±5(Shore OO)
High Light:

Multipurpose 3mm Thermal Pad For GPU

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Practical 3mm Thermal Pad For GPU

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Ultra Thin Thermal Pad For SSD

Ultra Soft Thermal Pad High Mechanical Strength with 1.0w thermal conductivity

 

Ultra Soft Thermal Pad High Mechanical Strength with 1.0w thermal conductivity are made by using silica gel and thermal conductive ceramic filler, adding glass fiber cloth as reinforcement material, and processed by special technology. With single-sided self-adhesive type, anti puncture and high breakdown voltage, it is a very soft thermal pad with excellent compressibility. It can be in close contact with electronic components, effectively reduce the interface resistance, and has excellent thermal conductivity.

 

UTP series thermal pad is made of soft silica gel thermal conductive material, which has the characteristics of good thermal conductivity, insulation, softness and elasticity. It is placed between the power heating device and the heat dissipation structure to effectively transfer the heat generated by the power module to the heat dissipation components to realize the heat dissipation of the system. It has self-adhesive property and is easy to apply without additional back glue. It can be cut into any size and shape according to the requirements of application environment to meet different design needs.

 

 

As a kind of flexible heat conducting material, UTP series is widely used in the gap filling between heating elements and radiating elements. In addition to the role of interface heat transfer, it can also play the role of insulation, shock absorption and buffer, absorption tolerance and so on.

 

 

Product features: Thermal Conductivity: 1.0W/mK, Ultra Soft, Reinforced Gap Filler Pad
Typical applications: Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

 

Product feature:
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
thermal silicone sheet has the convenience of installation, testing and reusable.
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

 

Typical applications:
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin 0

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

 

Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin 1

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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