Product Details:
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Composition: | Glass Fiber + Thermal Conductive Silicone | Color: | Pink |
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Thickness: | 0.23(mm) | Density: | 2.5 (g/cc) |
Hardness: | 85 (Shore A) | Tensile Strength: | >20(kn/m) |
Weight Damnify: | ≤1.0% | Usage Temperature: | -40 ℃ ~ 150 ℃ |
Flammability: | V-0 | Shelf Life: | 12 Month |
Breakdown Voltage: | ≥5.5(kv/mm) | Volume Resistivity: | 1.0*10^14(Ω.cm) |
Thermal Conductivity: | 1.6 W/m.K | Thermal Impedance: | <0.61 (℃-in2/W, 50psi) |
High Light: | Multiscene Thermal Sheet CPU,Heatsink Thermal Sheet CPU,Nontoxic Ultra Soft Heating Pad |
Features
High performance film
Excellent electrical insulation properties
Flammability UL 94 V-0
Low thermal resistance
Typical Applications
Power Modules
Heat generation power module
Automotive Electronic Heat Modules
Motor Control
Power Semiconductor
Typical Properties | ||
Properties | Attribute | Test Method |
Color | Pink | Visual |
Material | Glass fiber + thermal conductive silicone | / |
Thickness(mm) | 0.23 | / |
Density (g/cc) | 2.5 | ASTM D792 |
Hardness(Shore A) | 85 | ASTM D2240 |
Tearing strength(KN/m) | >20 | ASTM D624 |
Weight Damnify(%) | ≤1.0 | / |
Usage Temperature (°C) | - 40 to 150 | / |
Flammability | V-0 | UL 94 |
Shelf Life(month) | 12 | Temperature <40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage (kV) | > 5.5 | ASTM D149 |
Volume Resistivity (Ω.cm) | 1014 | ASTM D257 |
Thermal | ||
Thermal Conductivity (W/m-K) | 1.6 | ISO22007-2 |
Thermal Impedance (℃-in2/W, 50psi) |
<0.61 | ASTM D5470 |
Contact Person: Jason Zhan
Tel: +8613923884646