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Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene
Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Large Image :  Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Description
Color: White And Brick Red Density: 2.5(g/cc)
Product Name: Ultra Soft Thermal Pad Super Soft Good Thermal Insulation With 1.0w Thermal Conductivity(W/m.K): 1.0
Flammability: V-0 Volume Resistivity(Ω.cm): 1.0*10^13
High Light:

Electronics Ultra Soft Thermal Pad

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Anti Insulation Ultra Soft Thermal Pad

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Multiscene CPU Thermal Pad

Ultra Soft Thermal Pad Super soft good thermal insulation with 1.0w

 

UTP series products are made by using silica gel and thermal conductive ceramic filler, adding glass fiber cloth as reinforcement material, and processed by special technology. With single-sided self-adhesive type, anti puncture and high breakdown voltage, it is a very soft thermal pad with excellent compressibility. It can be in close contact with electronic components, effectively reduce the interface resistance, and has excellent thermal conductivity.

 

Ultra Soft Thermal Pad Super soft good thermal insulation with 1.0w is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap, open the heat channel between the heating part and the heat dissipation part, effectively improve the heat transfer efficiency, and also play the role of insulation, shock absorption and sealing. It can meet the design requirements of miniaturization and ultra-thin equipment. It is an excellent heat conduction filling material with great processability and usability, and wide thickness application range.

 

It is used for the control motherboard of electronic and electrical products, the inner and outer backing plates and foot pads of motors, electronic and electrical appliances, automotive machinery, computer hosts, laptops, DVDs, VCDs and any materials that need to be filled and heat dissipation modules.

 

 

Product features: Thermal Conductivity:1.0W/mK,Ultra Soft, Reinforced Gap Filler Pad
Typical applications: Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

 

Product feature:
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
thermal silicone sheet on the structure of the process difference bridge, reduce the process difference requirements of the radiator and heat dissipation structure;
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene 0

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene 1

 

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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