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Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene
Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene
Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Large Image :  Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Description
Color: White And Brick Red Density: 2.5(g/cc)
Product Name: Ultra Soft Thermal Pad Super Soft Good Thermal Insulation With 1.0w Thermal Conductivity(W/m.K): 1.0
Flammability: V-0 Volume Resistivity(Ω.cm): 1.0*10^13
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Electronics Ultra Soft Thermal Pad

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Anti Insulation Ultra Soft Thermal Pad

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Multiscene CPU Thermal Pad

Ultra Soft Thermal Pad Super soft good thermal insulation with 1.0W/m.K

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470
 

 

Product feature:
■ 
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ thermal silicone sheet on the structure of the process difference bridge, reduce the process difference requirements of the radiator and heat dissipation structure;
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene 0

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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