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Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/MK

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/MK

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/MK
Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/MK Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/MK

Large Image :  Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/MK

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/MK

Description
Tensile Strength(KN/m): 2.5 Elongation(%): 60
Usage Temperature(℃): -40~150 Product Name: Ultra Soft Thermal Pad High Mechanical Strength With 1.0w Thermal Conductivity
Density: 2.5(g/cc) Hardness: 30±5(Shore OO)
High Light:

Multiscene Laptop CPU Thermal Pad

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Anti Interfere Laptop CPU Thermal Pad

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1W/MK Thermal Cooling Pad Laptop

Ultra Soft Thermal Pad High Mechanical Strength with 1.0w thermal conductivity

 

Ultra Soft Thermal Pad High Mechanical Strength with 1.0w thermal conductivity is made of soft silica gel thermal conductive material, which has the characteristics of good thermal conductivity, insulation, softness and elasticity. It is placed between the power heating device and the heat dissipation structure to effectively transfer the heat generated by the power module to the heat dissipation components to realize the heat dissipation of the system. It has self-adhesive property and is easy to apply without additional back glue. It can be cut into any size and shape according to the requirements of application environment to meet different design needs.

 

UTP 100 is an extremely soft gap filler pad with a fiberglass reinforced liner, on one side. This combination allows for high breakdown voltage and cut through resistance, while providing the desirable low contact resistance and tolerance pickup of gap filling pads. UTP 100 versatility lends itself to a multitude of designs.

 

Product features: Thermal Conductivity: High Mechanical Strength, 1.0W/mK,Ultra Soft, Reinforced Gap Filler Pad
Typical applications: Between electronic components such as Semiconductor, IC, CPU. MOS and heatsink.

 

Product feature:
■ Naturally tacky on one side
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface;

■ with the addition of thermal silica gel, can make the contact surface between the heat source and the radiator better full contact, really do face to face contact. The reaction at temperature can achieve as small a temperature difference as possible;

 

Typical applications:
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/MK 0

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/MK 1

 

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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