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Electronic Epoxy Gel Potting Compound Encapsulant Multiscene Practical

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The LT is amazing, product looks good. Also the service quite nice.

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Electronic Epoxy Gel Potting Compound Encapsulant Multiscene Practical

Electronic Epoxy Gel Potting Compound Encapsulant Multiscene Practical
Electronic Epoxy Gel Potting Compound Encapsulant Multiscene Practical Electronic Epoxy Gel Potting Compound Encapsulant Multiscene Practical

Large Image :  Electronic Epoxy Gel Potting Compound Encapsulant Multiscene Practical

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: GF
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

Electronic Epoxy Gel Potting Compound Encapsulant Multiscene Practical

Description
Product Name: 1.0w/M.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Usage Temperature: -40~150(℃)
Thermal Resistance: 0.15 (℃-in2/W)0.1mm@50psi Dielectric Constant: 5.5(@10mhz)
Flammability: V-0 Thermal Conductivity: 0.8(W/m.K)
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Electronic Gel Potting Compound

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Practical Electronic Epoxy Encapsulant Potting Compounds

1.0w/M.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant

 

GF series thermally conductive potting encapsulant provides thermal conductivity and electrical insulative characteristics delivered in a two part dispensable and easily automated product. Additionally, the GF series provides protection from shock, dust, water, and vibration.
Product features:Thermal conductivity: 1.0~2.0W/m.K,Electrically insulating
Typical applications:Automotive: OBC, DC/DC Converter, Amplifiers

 

Thermally Conductive Encapsulant is a low-viscosity two-component silicone potting material. This product has good fluidity, does not produce small molecules during curing, has excellent thermal conductivity and insulation properties after curing, and has no corrosion to various substrates. It is mainly used for potting of electronic components and circuit boards, such as driving power supplies. Sensors, photovoltaic junction boxes, etc., provide protection for electrical/electronic devices and components under severe conditions such as high humidity, extreme temperature, thermal cycle stress, mechanical shock and vibration, mold, dirt, etc., no contact thermal resistance, seamless contact Heat-generating electronic components, heat is conducted from the separation device or the entire PCB to the metal shell or diffusion plate, thereby improving the efficiency and service life of the heat-generating electronic components.

 

Product feature
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time

 

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

 

 

Purchasing Information

Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)

 

Directions for use

• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes

 

Storage

Store in a cool, dry, well-ventilated place.

 

Shelf life

Shelf life of the product is 12 months after date of shipment.

 

Electronic Epoxy Gel Potting Compound Encapsulant Multiscene Practical 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Sliver Grey Visual
Density(g/cc) 1.8 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥10.0 ASTM D149
Dielectric Constant(@10mhz) 5.5 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^15 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 0.8 ASTM D5470
Viscosity/Component A (cps) 4500 ASTM D2196
Viscosity/Component B (cps) 4500 ASTM D2196
Hradness,after cure(shore OO) 60 ASTM D22240
Working Time@25℃(min) 30 ISO 9048

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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